High-Speed Backplane Systems

High-Density • Design Flexibility • High Reliability

Samtec’s high-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility. Samtec also offers SureWare™ guidance modules to assist with mating/unmating and help ensure a reliable connection.

Industries:

  • Military/Aerospace
  • Industrial
  • Medical
  • Automotive
  • Test Connectivity
  • AI/Machine Learning
  • Instrumentation
  • 5G Networking
  • Broadcast Video

Featured Products

ExaMAX® High-Speed Backplane System

Features

  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
  • PCIe® 6.0/CXL® 3.2 capable
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 24–72 pairs (board connectors) and 16–96 pairs (cable assemblies)
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec's Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press-fit termination
  • Power and Guide Modules available

XCede® HD High-Density Backplane System

Features

  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12–48 pairs
  • Up to a 3.00 mm contact wipe on signal pins
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
  • Power modules (HPTT/HPTS) are available as a standalone power solution with 10 Amps max per blade

Literature

High-Speed Backplane Systems Guide

ExaMAX® eBrochure

Xcede® HD eBrochure