Nexperia

MicroPak Automotive Q100

Nexperia's automotive-qualified Mini Logic types in leadless XSON packages

Image of Nexperia's MicroPak Automotive Q100 Nexperia's MicroPak Automotive Q100 addresses space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements. The Nexperia Q100 portfolio now includes more than 20 automotive-qualified functions in XSON leadless extremely-thin small-outline packages.

Features
  • Very small footprint: up to 60% space saving over equivalent leaded packages
  • Optimized for speed and power
  • Low propagation delay
  • Low dynamic power dissipation
  • Specified for partial power-down applications using IOFF

Applications

  • Infotainment
  • ADAS
  • BMS

MicroPak Automotive Q100

KuvaManufacturer Part NumberKuvausSaatavana oleva määrä HintaNäytä tiedot
IC BUFFER NON-INVERT 3.6V 6XSON74AUP1G125GM-Q100XIC BUFFER NON-INVERT 3.6V 6XSON4604 - Immediate$0.31Näytä tiedot
IC BUFFER NON-INVERT 3.6V 6XSON74AUP1G125GS-Q100HIC BUFFER NON-INVERT 3.6V 6XSON5121 - Immediate$0.33Näytä tiedot
IC GATE NOR 1CH 2-INP 5TSSOP74AUP1G02GW-Q100HIC GATE NOR 1CH 2-INP 5TSSOP153 - Immediate$0.24Näytä tiedot
IC INVERTER 1CH 1-INP 5TSSOP74AUP1G04GW-Q100HIC INVERTER 1CH 1-INP 5TSSOP5483 - Immediate$0.23Näytä tiedot
IC INVERTER 2CH 2-INP 6TSSOP74AUP2GU04GW-Q100HIC INVERTER 2CH 2-INP 6TSSOP1866 - Immediate$0.33Näytä tiedot
Published: 2020-09-30

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