The OSLON family features an excellent lifetime due to its silicone and ceramic materials. The innovative OSLON package features a ceramic substrate with an electrically isolated heat slug for greater heat dissipation and simplified board design. The combination of the ceramic package, heat slug and silicone optic all contribute to optimized light extraction and longer operating lifetimes. The electrically neutral heat slug facilitates heat transfer away from the die and into the thermal management system, usually an external heat sink. With its low thermal resistance and efficient operation, the OSLON can be mounted on MCPCB’s or cost effective board solutions such as FR4 with thermal vias can be used. Due to its small, symmetrical 3x3mm footprint, the OSLON can be packed into high density arrays to achieve greater light output in a smaller space.