Nexperia

MicroPak Automotive Q100

Nexperia's automotive-qualified Mini Logic types in leadless XSON packages

Image of Nexperia's MicroPak Automotive Q100 Nexperia's MicroPak Automotive Q100 addresses space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements. The Nexperia Q100 portfolio now includes more than 20 automotive-qualified functions in XSON leadless extremely-thin small-outline packages.

Features
  • Very small footprint: up to 60% space saving over equivalent leaded packages
  • Optimized for speed and power
  • Low propagation delay
  • Low dynamic power dissipation
  • Specified for partial power-down applications using IOFF

Applications

  • Infotainment
  • ADAS
  • BMS
Published: 2020-09-30

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