DMN4036LK3 Datasheet by Diodes Incorporated

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DMN4036LK3
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DMN4036LK3
40V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS RDS(on) ID
TA = 25°C
40V 36mΩ @ VGS= 10V 12.2A
61mΩ @ VGS= 4.5V 9.4A
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Backlighting
DC-DC Converters
Power management functions
Features and Benefits
Low on-resistance
Fast switching speed
“Green” component and RoHS compliant (Note 1)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: TO252-3L
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 (Note 1)
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.33 grams (approximate)
Ordering Information (Note 1)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
DMN4036LK3-13 N4036L 13 16 2,500
Note: 1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information about
Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
TOP VIEW PIN OUT -TOP VIEW
D
S
G
Equivalent Circuit
GS
D
D
= Manufacturer’s Marking
N4036L = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01 - 53)
YYWW
N4036L
TO252-3L
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Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source voltage VDSS 40 V
Gate-Source voltage (Note 2) VGS ±20 V
Continuous Drain current VGS = 10V
(Note 4)
ID
12.2
A
TA = 70°C (Note 4) 9.7
(Note 3) 8.5
Pulsed Drain current VGS = 10V (Note 5) IDM 31.7 A
Continuous Source current (Body diode) (Note 4) IS 10.4 A
Pulsed Source current (Body diode) (Note 5) ISM 31.7 A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Power dissipation
Linear derating factor
(Note 3)
PD
4.12
33 W
mW/°C
(Note 4) 8.49
67.9
(Note 6) 2.12
16.9
Thermal Resistance, Junction to Ambient
(Note 3)
RθJA
30.3
°C/W
(Note 4) 14.7
(Note 6) 59.0
Thermal Resistance, Junction to Lead (Note 7) R
θ
JL 3.1
Operating and storage temperature range TJ, TSTG -55 to 150 °C
Notes: 2. AEC-Q101 VGS maximum is ±16V.
3. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
4. Same as note 3, except the device is measured at t 10 sec.
5. Same as note 3, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
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Thermal Characteristics
100µ 1m 10m 100m 1 10 100 1k
0
10
20
30
40
50
60
110
100m
1
10
110
100m
1
10
Tamb=25°C
25mm x 25mm
1oz FR4
RDS(on)
Limited
100µs
1ms
10ms
100ms
1s
DC
Safe Operating Area
ID Drain Current (A)
VDS Drain-Source Voltage (V)
0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
50mm x 50mm
2oz FR4
25mm x 25mm
1oz FR4
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 1 10 100 1k
0
5
10
15
20
25
30
35
Tamb=25°C
25mm x 25mm
1oz FR4
Transient Thermal Impedance
D=0.5
D=0.2 D=0.1
Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s)
100µ 1m 10m 100m 1 10 100 1k
1
10
100
25mm x 25mm
1oz FR4
50mm x 50mm
2oz FR4
Safe Operating Area
Single Pulse
Tamb=25°C
Pulse Power Dissipation
Pulse Width (s)
Max Power Dissipation (W)
D=0.1
D=0.05
Single Pulse
D=0.2
D=0.5
Tamb=25°C
50mm x 50mm
2oz FR4
Transient Thermal Impedance
Pulse Width (s)
Thermal Resistance (°C/W)
Tamb=25°C
50mm x 50mm
2oz FR4 100µs
1ms
10ms
100ms
1s
DC
RDS(on)
Limited
VDS Drain-Source Voltage (V)
ID Drain Current (A)
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Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage BVDSS 40 V ID = 250μA, VGS = 0V
Zero Gate Voltage Drain Current IDSS 0.5 μA VDS = 40V, VGS = 0V
Gate-Source Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V
ON CHARACTERISTICS
Gate Threshold Voltage VGS
(
th
)
1.0 3.0 V
ID = 250μA, VDS = VGS
Static Drain-Source On-Resistance (Note 8) RDS (ON) 0.026 0.036 VGS = 10V, ID = 12A
0.049 0.061 VGS = 4.5V, ID = 6A
Forward Transconductance (Notes 8 & 9) gfs 19.6 S VDS = 15V, ID = 12A
Diode Forward Voltage (Note 8) VSD 0.96 1.1 V
IS = 12A, VGS = 0V
Reverse recovery time (Note 9) tr
r
112 ns IS = 12A, di/dt = 100A/μs
Reverse recovery charge (Note 9) Qr
r
926 nC
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance Ciss 453 pF VDS = 20V, VGS = 0V
f = 1MHz
Output Capacitance Coss 79.1 pF
Reverse Transfer Capacitance Crss 40.5 pF
Total Gate Charge (Note 10) Q
g
4.9 nC VGS = 4.5V
VDS = 20V
ID = 12A
Total Gate Charge (Note 10) Q
g
9.2 nC
VGS = 10V
Gate-Source Charge (Note 10) Q
g
s 1.7 nC
Gate-Drain Charge (Note 10) Q
g
d 2.7 nC
Turn-On Delay Time (Note 10) tD
on
3.2 ns
VDD = 20V, VGS = 10V
ID = 12A, RG 6.0Ω
Turn-On Rise Time (Note 10) t
r
11.7 ns
Turn-Off Delay Time (Note 10) tD
off
11.6 ns
Turn-Off Fall Time (Note 10) tf 9.5 ns
Notes: 8. Measured under pulsed conditions. Pulse width 300μs; duty cycle 2%
9. For design aid only, not subject to production testing.
10. Switching characteristics are independent of operating junction temperatures.
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Typical Characteristics
0.1 1 10
0.01
0.1
1
10
0.1 1 10
0.01
0.1
1
10
12345
1E-3
0.01
0.1
1
10
-50 0 50 100 150
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01 0.1 1 10
0.01
0.1
1
10
0.2 0.4 0.6 0.8 1.0
0.01
0.1
1
10
4V
3.5V
10V 4.5V
Output Characteristics
T = 25°C
3V
VGS
ID Drain Current (A)
VDS Drain-Source Voltage (V)
3.5V
10V 4V
2V
2.5V
3V
Output Characteristics
T = 150°C
VGS
ID Drain Current (A)
VDS Drain-Source Voltage (V)
Typical Transfer Characteristics
VDS = 10V
T = 2C
T = 150°C
ID Drain Current (A)
VGS Gate-Source Voltage (V) Normalised Curves v Temperature
RDS(on)
VGS = 10V
ID = 12A
VGS(th)
VGS = VDS
ID = 250uA
Normalised RDS(on) and VGS(th)
Tj Junction Temperature (°C)
10V
3.5V
4V
3V
On-Resistance v Drain Current
T = 25°C
4.5V
VGS
RDS(on) Drain-Source On-Resistance (Ω)
ID Drain Current (A)
Vgs = 0V
T = 150°C
T = 25°C
Source-Drain Diode Forward Voltage
VSD Source-Drain Voltage (V)
ISD Reverse Drain Current (A)
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DMN4036LK3
Document number: DS32122 Rev. 2 - 2
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Typical Characteristics - continued
0.1 1 10
0
100
200
300
400
500
600
CRSS
COSS
CISS
VGS = 0V
f = 1MHz
C Capacitance (pF)
VDS - Drain - Source Voltage (V) 0246810
0
2
4
6
8
10
VDS = 20V
ID = 12A
Gate-Source Voltage v Gate ChargeCapacitance v Drain-Source Voltage
Q - Charge (nC)
VGS Gate-Source Voltage (V)
Test Circuits
Current
regulator
Charge
Gate charge test circuit
Switching time test circuit
Basicgatechargewaveform
Switching time waveforms
D.U.T
50k
12V Same as
D.U.T
V
GS
V
GS
V
DS
V
G
Q
GS
Q
GD
Q
G
V
GS
90%
10%
t
(on)
t
(on)
t
d(on)
t
r
t
r
t
V
DS
DD
V
R
D
R
G
V
DS
I
D
I
G
d(off)
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Package Outline Dimensions
DIM Inches Millimeters DIM Inches Millimeters
Min Max Min Max Min Max Min Max
A 0.086 0.094 2.18 2.39 e 0.090 BSC 2.29 BSC
A1 - 0.005 - 0.127 H 0.370 0.410 9.40 10.41
b 0.020 0.035 0.508 0.89 L 0.055 0.070 1.40 1.78
b2 0.030 0.045 0.762 1.14 L1 0.108 REF 2.74 REF
b3 0.205 0.215 5.21 5.46 L2 0.020 BSC 0.508 BSC
c 0.018 0.024 0.457 0.61 L3 0.035 0.065 0.89 1.65
c2 0.018 0.023 0.457 0.584 L4 0.025 0.040 0.635 1.016
D 0.213 0.245 5.41 6.22 L5 0.045 0.060 1.14 1.52
D1 0.205 - 5.21 - θ 0° 10° 0° 10°
E 0.250 0.265 6.35 6.73 θ° 0° 15° 0° 15°
E1 0.170 - 4.32 - - - - - -
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Suggested Pad Layout
5.8
0.228
1.6
0.063
6.2
0.244
3.0
0.118
6.17
0.243
2.58
0.101
mm
inches
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