A3984 Datasheet by Allegro MicroSystems

24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
Translator
CP1
CP2
VCP
VREG
MS1
MS2
RESET
ROSC
SLEEP
VDD
STEP
REF
GND
ENABLE
OUT2B
VBB2
SENSE2
GND
OUT2A
OUT1A
SENSE1
VBB1
OUT1B
DIR
Charge
Pump
Reg
OSC
& Control Logic
Description
The A3984 is a complete microstepping motor driver with
built-in translator for easy operation. It is designed to
operate bipolar stepper motors in full-, half-, quarter-, and
sixteenth-step modes, with an output drive capacity of up to
35 V and ±2 A. The A3984 includes a fixed off-time current
regulator which has the ability to operate in Slow or Mixed
decay modes.
The translator is the key to the easy implementation of the
A3984. Simply inputting one pulse on the STEP input drives
the motor one microstep. There are no phase sequence
tables, high frequency control lines, or complex interfaces to
program. The A3984 interface is an ideal fit for applications
where a complex microprocessor is unavailable or is
overburdened.
The chopping control in the A3984 automatically selects
the current decay mode (Slow or Mixed). When a signal
occurs at the STEP input pin, the A3984 determines if
that step results in a higher or lower current in each of the
motor phases. If the change is to a higher current, then
the decay mode is set to Slow decay. If the change is to a
lower current, then the current decay is set to Mixed (set
26184.30E
Features and Benefits
Low RDS(ON) outputs
Automatic current decay mode detection/selection
Mixed and Slow current decay modes
Synchronous rectification for low power dissipation
Internal UVLO and thermal shutdown circuitry
Crossover-current protection
DMOS Microstepping Driver with Translator
Continued on the next page…
Package: 24-pin TSSOP with exposed
thermal pad (suffix LP)
Pin-out Diagram
Not to scale
A3984
DMOS Microstepping Driver with Translator
A3984
2
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
THERMAL CHARACTERISTICS
initially to a fast decay for a period amounting to 31.25% of
the fixed off-time, then to a slow decay for the remainder of the
off-time). This current decay control scheme results in reduced
audible motor noise, increased step accuracy, and reduced power
dissipation.
Internal synchronous rectification control circuitry is provided to
improve power dissipation during PWM operation.
Internal circuit protection includes: thermal shutdown with
hysteresis, undervoltage lockout (UVLO), and crossover-current
protection. Special power-on sequencing is not required.
The A3984 is supplied in a low-profile (1.2 mm maximum),
24-pin TSSOP with exposed thermal pad (package LP). It is lead
(Pb) free, with 100% matte tin leadframe plating.
Description (continued)
Selection Guide
Part Number Packing
A3984SLPTR-T 4000 pieces per 13-in. reel
Absolute Maximum Ratings
Characteristic Symbol Notes Rating Units
Load Supply Voltage VBB 35 V
Output Current IOUT
Output current rating may be limited by duty cycle, ambient
temperature, and heat sinking. Under any set of conditions,
do not exceed the specified current rating or a junction tem-
perature of 150°C.
±2 A
Logic Input Voltage VIN –0.3 to 7 V
Sense Voltage VSENSE 0.5 V
Reference Voltage VREF 4V
Operating Ambient Temperature TARange S –20 to 85 ºC
Maximum Junction TJ(max) 150 ºC
Storage Temperature Tstg –55 to 150 ºC
Characteristic Symbol Test Conditions* Value Units
Package Thermal Resistance RθJA 4-layer PCB, based on JEDEC standard 28 ºC/W
*Additional thermal information available on Allegro Web site.
20 40 60 80 100 120 140 160 180
Temperature (°C)
Power Dissipation, P
D
(W)
0.0
0.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1.0
1.5
Maximum Power Dissipation, PD(max)
(R
θJA
= 28 ºC/W)
DMOS Microstepping Driver with Translator
A3984
3
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Block Diagram
SENSE1
SENSE2
VREG
VCP
CP2
Control
Logic
DAC
VDD
PWM Latch
Blanking
Mixed Decay
DAC
STEP
DIR
RESET
MS1
PWM Latch
Blanking
Mixed Decay
Current
Regulator
CP1
Charge
Pump
RS2
RS1
VBB1
OUT1A
OUT1B
VBB2
OUT2A
OUT2B
0.1 uF
VREF
Translator
Gate
Drive DMOS Full Bridge
DMOS Full Bridge
0.1 uF
0.22 uF
OSC
ROSC
MS2
REF
ENABLE
SLEEP
DMOS Microstepping Driver with Translator
A3984
4
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS1 at TA = 25°C, VBB = 35 V (unless otherwise noted)
1Negative current is defined as coming out of (sourcing from) the specified device pin.
2Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for
individual units, within the specified maximum and minimum limits.
3errI = (ITrip IProg
) IProg
, where IProg = %ITripMAX I TripMAX.
Characteristics Symbol Test Conditions Min. Typ.2Max. Units
Output Drivers
Load Supply Voltage Range VBB
Operating 8 35 V
During Sleep Mode 0 35 V
Logic Supply Voltage Range VDD Operating 3.0 5.5 V
Output On Resistance RDSON
Source Driver, IOUT = –1.5 A 0.350 0.450
Sink Driver, IOUT = 1.5 A 0.300 0.370
Body Diode Forward Voltage VF
Source Diode, IF = –1.5 A 1.2 V
Sink Diode, IF = 1.5 A 1.2 V
Motor Supply Current IBB
fPWM < 50 kHz 4 mA
Operating, outputs disabled 2 mA
Sleep Mode 10 A
Logic Supply Current IDD
fPWM < 50 kHz 8 mA
Outputs off 5 mA
Sleep Mode 10 A
Control Logic
Logic Input Voltage VIN(1) VDD0.7 ––V
VIN(0) ––
VDD0.3 V
Logic Input Current IIN(1) VIN = VDD0.7 –20 <1.0 20 A
IIN(0) VIN = VDD0.3 –20 <1.0 20 A
Microstep Select 2 MS2 50 k
Input Hysteresis VHYS(IN) 150 300 500 mV
Blank Time tBLANK 0.7 1 1.3 s
Fixed Off-Time tOFF
OSC > 3 V 20 30 40 s
ROSC = 25 k23 30 37 s
Reference Input Voltage Range VREF 0–4V
Reference Input Current IREF –3 0 3 A
Current Trip-Level Error3errI
VREF = 2 V, %ITripMAX = 38.27% ±15 %
VREF = 2 V, %ITripMAX = 70.71% ±5 %
VREF = 2 V, %ITripMAX = 100.00% ±5 %
Crossover Dead Time tDT 100 475 800 ns
Protection
Thermal Shutdown Temperature TJ– 165 – °C
Thermal Shutdown Hysteresis TJHYS –15–°C
UVLO Enable Threshold UVLO VDD rising 2.35 2.7 3 V
UVLO Hysteresis UVHYS 0.05 0.10 V
DMOS Microstepping Driver with Translator
A3984
5
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 1. Logic Interface Timing Diagram
STEP
t
A
t
D
t
C
MS1, MS2,
RESET, or DIR
t
B
Table 1. Microstep Resolution Truth Table
MS1 MS2 Microstep Resolution Excitation Mode
L L Full Step 2 Phase
H L Half Step 1-2 Phase
L H Quarter Step W1-2 Phase
H H Sixteenth Step 4W1-2 Phase
Time Duration Symbol Typ. Unit
STEP minimum, HIGH pulse width tA1s
STEP minimum, LOW pulse width tB1s
Setup time, input change to STEP tC200 ns
Hold time, input change to STEP tD200 ns
DMOS Microstepping Driver with Translator
A3984
6
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Description
Device Operation. The A3984 is a complete microstep-
ping motor driver with a built-in translator for easy operation
with minimal control lines. It is designed to operate bipolar
stepper motors in full-, half-, quarter-, and sixteenth-step
modes. The currents in each of the two output full-bridges
and all of the N-channel DMOS FETs are regulated with
fixed off-time PMW (pulse width modulated) control cir-
cuitry. At each step, the current for each full-bridge is set by
the value of its external current-sense resistor (RS1 or RS2), a
reference voltage (VREF), and the output voltage of its DAC
(which in turn is controlled by the output of the translator).
At power-on or reset, the translator sets the DACs and the
phase current polarity to the initial Home state (shown in fig-
ures 2 through 5), and the current regulator to Mixed Decay
Mode for both phases. When a step command signal occurs
on the STEP input, the translator automatically sequences the
DACs to the next level and current polarity. (See table 2 for
the current-level sequence.) The microstep resolution is set
by the combined effect of inputs MS1 and MS2, as shown in
table 1.
When stepping, if the new output levels of the DACs are
lower than their previous output levels, then the decay mode
for the active full-bridge is set to Mixed. If the new output
levels of the DACs are higher than or equal to their previous
levels, then the decay mode for the active full-bridge is set
to Slow. This automatic current decay selection improves
microstepping performance by reducing the distortion of
the current waveform that results from the back EMF of the
motor.
RESET Input (RESET). The RESET input sets the
translator to a predefined Home state (shown in figures 2
through 5), and turns off all of the DMOS outputs. All STEP
inputs are ignored until the RESET input is set to high.
Step Input (STEP). A low-to-high transition on the STEP
input sequences the translator and advances the motor one
increment. The translator controls the input to the DACs and
the direction of current flow in each winding. The size of
the increment is determined by the combined state of inputs
MS1 and MS2.
Microstep Select (MS1 and MS2). Selects the micro-
stepping format, as shown in table 1. MS2 has a 50 kΩ pull-
down resistance. Any changes made to these inputs do not take
effect until the next STEP rising edge.
Direction Input (DIR). This determines the direction of
rotation of the motor. When low, the direction will be clock-
wise and when high, counterclockwise. Changes to this input
do not take effect until the next STEP rising edge.
Internal PWM Current Control. Each full-bridge is
controlled by a fixed off-time PWM current control circuit
that limits the load current to a desired value, ITRIP
. Ini-
tially, a diagonal pair of source and sink DMOS outputs are
enabled and current flows through the motor winding and
the current sense resistor, RSx. When the voltage across RSx
equals the DAC output voltage, the current sense compara-
tor resets the PWM latch. The latch then turns off either the
source DMOS FETs (when in Slow Decay Mode) or the sink
and source DMOS FETs (when in Mixed Decay Mode).
The maximum value of current limiting is set by the selec-
tion of RSx and the voltage at the VREF pin. The transcon-
ductance function is approximated by the maximum value of
current limiting, ITripMAX (A), which is set by
ITripMAX = VREF / ( 8 R S
)
where RS is the resistance of the sense resistor (Ω) and VREF
is the input voltage on the REF pin (V).
The DAC output reduces the VREF output to the current
sense comparator in precise steps, such that
Itrip = (%ITripMAX / 100) × ITripMAX
(See table 2 for %ITripMAX at each step.)
It is critical that the maximum rating (0.5 V) on the SENSE1
and SENSE2 pins is not exceeded.
Fixed Off-Time. The internal PWM current control cir-
cuitry uses a one-shot circuit to control the duration of time
that the DMOS FETs remain off. The one shot off-time, tOFF,
is determined by the selection of an external resistor con-
nected from the ROSC timing pin to ground. If the ROSC
Functional Description
DMOS Microstepping Driver with Translator
A3984
7
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
pin is tied to an external voltage > 3 V, then tOFF defaults to 30 μs.
The ROSC pin can be safely connected to the VDD pin for this
purpose. The value of tOFF (μs) is approximately
tOFF = ROSC 825
Blanking. This function blanks the output of the current sense
comparators when the outputs are switched by the internal current
control circuitry. The comparator outputs are blanked to prevent
false overcurrent detection due to reverse recovery currents of the
clamp diodes, and switching transients related to the capacitance of
the load. The blank time, tBLANK (μs), is approximately
tBLANK 1 μs
Charge Pump (CP1 and CP2). The charge pump is used to
generate a gate supply greater than that of VBB for driving the
source-side DMOS gates. A 0.1 μF ceramic capacitor, should be
connected between CP1 and CP2. In addition, a 0.1 μF ceramic
capacitor is required between VCP and VBB, to act as a reservoir
for operating the high-side DMOS gates.
VREG (VREG). This internally-generated voltage is used to
operate the sink-side DMOS outputs. The VREG pin must be
decoupled with a 0.22 μF capacitor to ground. VREG is internally
monitored. In the case of a fault condition, the DMOS outputs of
the A3984 are disabled.
Enable Input (ENABLE). This input turns on or off all of the
DMOS outputs. When set to a logic high, the outputs are disabled.
When set to a logic low, the internal control enables the outputs as
required. The translator inputs STEP, DIR, MS1, and MS2, as well
as the internal sequencing logic, all remain active, independent of
the ENABLE input state.
Shutdown. In the event of a fault, overtemperature (excess TJ)
or an undervoltage (on VCP), the DMOS outputs of the A3984
are disabled until the fault condition is removed. At power-on, the
UVLO (undervoltage lockout) circuit disables the DMOS outputs
and resets the translator to the Home state.
Sleep Mode (SLEEP). To minimize power consumption when
the motor is not in use, this input disables much of the internal
circuitry including the output DMOS FETs, current regulator,
and charge pump. A logic low on the SLEEP pin puts the A3984
into Sleep mode. A logic high allows normal operation, as well as
start-up (at which time the A3984 drives the motor to the Home
microstep position). When emerging from Sleep mode, in order to
allow the charge pump to stabilize, provide a delay of 1 ms before
issuing a Step command.
Mixed Decay Operation. The bridge can operate in Mixed
Decay mode, depending on the step sequence, as shown in figures
3 thru 5. As the trip point is reached, the A3984 initially goes into
a fast decay mode for 31.25% of the off-time. tOFF. After that, it
switches to Slow Decay mode for the remainder of tOFF.
Synchronous Rectification. When a PWM-off cycle is
triggered by an internal fixed–off-time cycle, load current recir-
culates according to the decay mode selected by the control logic.
This synchronous rectification feature turns on the appropriate
FETs during current decay, and effectively shorts out the body
diodes with the low DMOS RDSON. This reduces power dissipa-
tion significantly, and can eliminate the need for external Schottky
diodes in many applications. Turning off synchronous rectification
prevents the reversal of the load current when a zero-current level is
detected.
DMOS Microstepping Driver with Translator
A3984
8
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 4. Decay Modes for Quarter-Step Increments
Figure 3. Decay Modes for Half-Step IncrementsFigure 2. Decay Mode for Full-Step Increments
Phase 2
I
OUT2A
Direction = H
(%)
Phase 1
I
OUT1A
Direction = H
(%)
STEP
Home Microstep Position
Home Microstep Position
100.00
70.71
–70.71
0.00
–100.00
100.00
70.71
–70.71
0.00
–100.00
Slow
Slow
Home Microstep Position
Home Microstep Position
100.00
70.71
–70.71
0.00
–100.00
100.00
70.71
–70.71
0.00
–100.00
Phase 2
I
OUT2B
Direction = H
(%)
Phase 1
I
OUT1A
Direction = H
(%)
STEP
Slow
Mixed
Slow
Mixed
Slow
Mixed
Mixed
Slow
Mixed
Slow
Mixed
Slow
Slow
0.00
100.00
92.39
70.71
38.27
–38.27
–70.71
–92.39
–100.00
0.00
100.00
92.39
70.71
38.27
–38.27
–70.71
–92.39
–100.00
Phase 2
I
OUT2B
Direction = H
(%)
Phase 1
I
OUT1A
Direction = H
(%)
Home Microstep Position
Slow Mixed Slow
Slow Mixed
Slow Mixed Slow MixedMixed
STEP
Slow
DMOS Microstepping Driver with Translator
A3984
9
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 5. Decay Modes for Sixteenth-Step Increments
MixedSlow MixedSlow
MixedSlow Slow
Slow
100.00
95.69
88.19
83.15
–83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
9.8
0.00
–100.00
–95.69
–88.19
–77.30
–70.71
–63.44
–55.56
–47.14
–38.27
–29.03
–19.51
–9.8
100.00
95.69
88.19
83.15
–83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
9.8
0.00
–100.00
–95.69
–88.19
–77.30
–70.71
–63.44
–55.56
–47.14
–38.27
–29.03
–19.51
–9.8
Phase 2
IOUT2B
Direction = H
(%)
Phase 1
IOUT1A
Direction = H
(%)
Home Microstep Position
Mixed
STEP
DMOS Microstepping Driver with Translator
A3984
10
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Full
Step
#
Half
Step
#
1/4
Step
#
1/16
Step
#
Phase 1
Current
[% ItripMax]
(%)
Phase 2
Current
[% ItripMax]
(%)
Step
Angle
(º)
Full
Step
#
Half
Step
#
1/4
Step
#
1/16
Step
#
Phase 1
Current
[% ItripMax]
(%)
Phase 2
Current
[% ItripMax]
(%)
Step
Angle
(º)
1 1 1 100.00 0.00 0.0 5 9 33 –100.00 0.00 180.0
2 99.52 9.80 5.6 34 –99.52 –9.80 185.6
3 98.08 19.51 11.3 35 –98.08 –19.51 191.3
4 95.69 29.03 16.9 36 –95.69 –29.03 196.9
2 5 92.39 38.27 22.5 10 37 –92.39 –38.27 202.5
6 88.19 47.14 28.1 38 –88.19 –47.14 208.1
7 83.15 55.56 33.8 39 –83.15 –55.56 213.8
8 77.30 63.44 39.4 40 –77.30 –63.44 219.4
1 2 3 9 70.71 70.71 45.0 3 6 11 41 –70.71 –70.71 225.0
10 63.44 77.30 50.6 42 –63.44 –77.30 230.6
11 55.56 83.15 56.3 43 –55.56 –83.15 236.3
12 47.14 88.19 61.9 44 –47.14 –88.19 241.9
4 13 38.27 92.39 67.5 12 45 –38.27 –92.39 247.5
14 29.03 95.69 73.1 46 –29.03 –95.69 253.1
15 19.51 98.08 78.8 47 –19.51 –98.08 258.8
16 9.80 99.52 84.4 48 –9.80 –99.52 264.4
3 5 17 0.00 100.00 90.0 7 13 49 0.00 –100.00 270.0
18 –9.80 99.52 95.6 50 9.80 –99.52 275.6
19 –19.51 98.08 101.3 51 19.51 –98.08 281.3
20 –29.03 95.69 106.9 52 29.03 –95.69 286.9
6 21 –38.27 92.39 112.5 14 53 38.27 –92.39 292.5
22 –47.14 88.19 118.1 54 47.14 –88.19 298.1
23 –55.56 83.15 123.8 55 55.56 –83.15 303.8
24 –63.44 77.30 129.4 56 63.44 –77.30 309.4
2 4 7 25 –70.71 70.71 135.0 4 8 15 57 70.71 –70.71 315.0
26 –77.30 63.44 140.6 58 77.30 –63.44 320.6
27 –83.15 55.56 146.3 59 83.15 –55.56 326.3
28 –88.19 47.14 151.9 60 88.19 –47.14 331.9
8 29 –92.39 38.27 157.5 16 61 92.39 –38.27 337.5
30 –95.69 29.03 163.1 62 95.69 –29.03 343.1
31 –98.08 19.51 168.8 63 98.08 –19.51 348.8
32 –99.52 9.80 174.4 64 99.52 –9.80 354.4
Table 2. Step Sequencing Settings
Home microstep position at Step Angle 45º; DIR = H
DMOS Microstepping Driver with Translator
A3984
11
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Pin List Table
Name Description Number
CP1 Charge pump capacitor 1 1
CP2 Charge pump capacitor 2 2
VCP Reservoir capacitor 3
VREG Regulator decoupling 4
MS1 Logic input 5
MS2 Logic input 6
RESET Logic input 7
ROSC Timing set 8
SLEEP Logic input 9
VDD Logic supply 10
STEP Logic input 11
REF Current trip reference voltage input 12
GND Ground* 13
DIR Logic input 14
OUT1B DMOS Full Bridge 1 Output B 15
VBB1 Load supply 16
SENSE1 Sense resistor for Bridge 1 17
OUT1A DMOS Full Bridge 1 Output A 18
OUT2A DMOS Full Bridge 2 Output A 19
SENSE2 Sense resistor for Bridge 2 20
VBB2 Load supply 21
OUT2B DMOS Full Bridge 2 Output B 22
ENABLE Logic input 23
GND Ground* 24
*The two GND pins must be tied together externally by connecting
to the exposed pad ground plane under the device.
uuuuuuuuuuuu‘J x flufimmmmm] *';9%Ei + l 1 ‘ i i ‘ * nnn‘nnnnnnnnn LV ,UUUUUUUUWUU 7 *1 E L h; A >EE,auulRerevence\/wen
DMOS Microstepping Driver with Translator
A3984
12
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
LP Package, 24-Pin TSSOP with Exposed Thermal Pad
1.20 MAX
C
SEATING
PLANE
0.15 MAX
C0.10
24X
0.65
6.103.00
4.32
1.65
0.45
0.65
0.25
21
24
3.00
4.32
(1.00)
GAUGE PLANE
SEATING PLANE
B
A
ATerminal #1 mark area
B
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
Exposed thermal pad (bottom surface)
C
C
7.80 ±0.10
4.40 ±0.10 6.40 ±0.20 0.60 ±0.15
4° ±4
0.25 +0.05
–0.06
0.15 +0.05
–0.06
Copyright ©2005-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com