INA159-EP Datasheet by Texas Instruments

I TEXAS INSTRUMENTS
1
FEATURES
DESCRIPTION
APPLICATIONS
SUPPORTS DEFENSE, AEROSPACE,
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
PRECISION, GAIN OF 0.2 LEVELTRANSLATION DIFFERENCE AMPLIFIER
2
Gain of 0.2 to Interface ± 10-V Signals toSingle-Supply ADCs
The INA159 is a high slew rate, G = 1/5 differenceamplifier consisting of a precision op amp with aGain Accuracy: ± 0.024% (max)
precision resistor network. The gain of 1/5 makes theWide Bandwidth: 1.5 MHz
INA159 useful to couple ± 10-V signals toHigh Slew Rate: 15 V/ µs
single-supply analog-to-digital converters (ADCs),Low Offset Voltage: ± 100 µVparticularly those operating on a single +5-V supply.The on-chip resistors are laser-trimmed for accurateLow Offset Drift: ± 1.5 µV/ ° C
gain and high common-mode rejection. ExcellentSingle-Supply Operation Down to 1.8 V
temperature coefficient of resistance (TCR) trackingof the resistors maintains gain accuracy andcommon-mode rejection over temperature. The inputcommon-mode voltage range extends beyond theIndustrial Process Controls
positive and negative supply rails. It operates on aInstrumentation
total of 1.8-V to 5.5-V single or split supplies. TheDifferential to Single-Ended Conversion
INA159 reference input uses two resistors for easyAudio Line Receivers
mid-supply or reference biasing.
The difference amplifier is the foundation of manycommonly-used circuits. The INA159 provides thisAND MEDICAL APPLICATIONS
circuit function without using an expensive externalControlled Baseline
precision resistor network. The INA159 is available inOne Assembly/Test Site
an MSOP-8 surface-mount package and is specifiedfor operation over the extended industrial temperatureOne Fabrication Site
range, 55 ° C to 125 ° C.Available in Military ( 55 ° C/125 ° C)Temperature Range
(1)
Extended Product Life CycleExtended Product-Change NotificationProduct Traceability(1) Additional temperature ranges are available - contact factory
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
l TEXAS INSTRUMENTS WWI—WW LIUULI
20k
100k
40k
100k
40k
R1
100ADS8325
ADC
DOUT
DCLOCK
CS
REF
VREF
5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
REF 1
IN
+IN
V
REF 2
V+
OUT
SENSE
1
2
3
4
8
7
6
5
INA159
TOP VIEW MSOP
INA159-EP
SBOS443 – NOVEMBER 2008 ..........................................................................................................................................................................................
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Figure 1. Typical Application
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
ORDERABLE PART PACKAGETEMPERATURE PACKAGE LEAD TOP-SIDE MARKINGNUMBER
(2)
DESIGNATOR
-55 ° C to 125 ° C INA159AMDGKTEP MSOP-8 Tape and reel DGK OAA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com.(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package .
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ABSOLUTE MAXIMUM RATINGS
(1)
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage +5.5 V
Signal input terminals ( IN and +IN), voltage ± 30 V
Reference (REF 1 and REF2) and sense pins Current ± 10 mA
Voltage (V ) – 0.5 (V+) + 0.5 V
Output short circuit Continuous
Operating temperature 55 +125 ° C
Storage temperature 65 +150 ° C
Junction temperature +150 ° C
ESD rating Human-Body Model 4000 V
Charged-Device Model 1000 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods maydegrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose specified is not supported.
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ELECTRICAL CHARACTERISTICS
INA159-EP
SBOS443 – NOVEMBER 2008 ..........................................................................................................................................................................................
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Boldface limits apply over the specified temperature range, T
A
= 55 ° C to +125 ° C.At T
A
= +25 ° C, R
L
= 10 k connected to V
S
/2, REF pin 1 connected to ground, and REF pin 2 connected to V
REF
= 5 V,unless otherwise noted.
INA159PARAMETER CONDITIONS UNITMIN TYP MAX
OFFSET VOLTAGE
(1)
RTO
V
S
= ± 2.5 V, Reference and InputInitial
(1)
V
OS
± 100 ± 500 µVPins Grounded
Over Temperature ± 1450 µV
vs Power Supply PSRR V
S
= ± 0.9 V to ± 2.75 V ± 20 ± 100 µV/V
Over Temperature PSRR V
S
= ± 0.9 V to ± 2.75 V ± 200 µV/V
Reference Divider Accuracy
(2)
± 0.002 ± 0.024 %
over Temperature ± 0.002 ± 0.050 %
INPUT IMPEDANCE
(3)
Differential 240 k
Common-Mode 60 k
INPUT VOLTAGE RANGE RTI
Common-Mode Voltage Range V
CM
Positive 17.5 V
Negative – 12.5 V
Common-Mode Rejection Ratio CMRR V
CM
= – 10 V to +10 V, R
S
= 0 80 96 dB
over Temperature 74 94 dB
OUTPUT VOLTAGE NOISE
(4)
RTO
f = 0.1 Hz to 10 Hz 10 µVPP
f = 10 kHz 30 nV/ Hz
V
REF2
= 4.096 V,R
L
Connected to GND,GAIN
(V
IN+
) (VIN – ) = – 10 V to +10 V,V
CM
= 0 V
Initial G 0.2 V/V
Error ± 0.005 ± 0.024 %
vs Temperature ± 0.035 %
Nonlinearity ± 0.0002 % of FS
OUTPUT
V
REF2
= 4.096 V, (V+) Voltage, Positive (V+) – 0.1 VR
L
Connected to GND 0.02
over Temperature (V+) – 0.2 V
V
REF2
= 4.096 V, (V ) +Voltage, Negative (V ) + 0.048 VR
L
Connected to GND 0.01
over Temperature (V ) + 0.070 V
Current Limit, Continuous to Common ± 60 mA
Capacitive Load See Typical Characteristic pF
Open-Loop Output Impedance R
O
f = 1 MHz, I
O
= 0 110
FREQUENCY RESPONSE
Small-Signal Bandwidth – 3 dB 1.5 MHz
Slew Rate SR 15 V/ µs
Settling Time, 0.01% t
S
4 V Output Step, C
L
= 100 pF 1 µs
(1) Includes effects of amplifier input bias and offset currents.(2) Reference divider accuracy specifies the match between the reference divider resistors using the configuration in Figure 2 .(3) Internal resistors are ratio matched but have 20% absolute value.(4) Includes effects of amplifier input current noise and thermal noise contribution of resistor network.
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l TEXAS INSTRUMENTS
20k
40k
100k
2
3
7
5
OUT
1
8
6
V+
4
V
+5V
100k
40k
INA159
The test is performed by
measuring the output
with the reference
applied to alternate
reference resistors, and
calculating a result such
that the amplifier offset is
cancelled in the final
measurement.
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
ELECTRICAL CHARACTERISTICS (continued)Boldface limits apply over the specified temperature range, T
A
= 55 ° C to +125 ° C.At T
A
= +25 ° C, R
L
= 10 k connected to V
S
/2, REF pin 1 connected to ground, and REF pin 2 connected to V
REF
= 5 V,unless otherwise noted.
INA159PARAMETER CONDITIONS UNITMIN TYP MAX
Overload Recovery Time 50% Overdrive 250 ns
POWER SUPPLY
Specified Voltage Range V
S
+5 V
Operating Voltage Range +1.8 +5.5 V
I
O
= 0 mA, V
S
= ± 2.5 V, ReferenceQuiescent Current I
Q
1.1 1.5 mAand Input Pins Grounded
over Temperature 2.0 mA
TEMPERATURE RANGE
Specified Range 55 +125 ° C
Operating Range 55 +125 ° C
Storage Range 65 +150 ° C
Thermal Resistance θJA
MSOP-8 Surface Mount 150 ° C/W
Figure 2. Test Circuit for Reference Divider Accuracy
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TYPICAL CHARACTERISTICS
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Offset Voltage Drift (µV/_C)
Population
10
9
8
7
6
5
4
3
2
1
0
1
2
3
4
5
6
7
8
9
10
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (µV)
Population
500
450
400
350
300
250
200
150
100
50
0
50
100
150
200
250
300
350
400
450
500
GAIN vs FREQUENCY
Frequency (Hz)
Gain (dB)
0
10
20
30
40
50 100 1k 10k 100k 1M 10M
10
POWER−SUPPLY REJECTION RATIO vs FREQUENCY
Frequency (Hz)
PSRR (dB)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k 100k 1M 10M10
COMMON−MODE REJECTION RATIO vs FREQUENCY
Frequency (Hz)
CMRR (dB)
120
110
100
90
80
70
60
50
40
30
20 100 1k 10k 100k 1M 10M
10
QUIESCENT CURRENT vs TEMPERATURE
Temperature (_C)
IQ(mA)
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80 25 0 25 50 75 100 125
50
VS= 5.5V
VS= 1.8V
VS= 5V
INA159-EP
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At T
A
= +25 ° C, R
L
= 10 k connected to V
S
/2, REF pin 1 connected to ground, and REF pin 2 connected to V
REF
= 5 V,unless otherwise noted.
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l TEXAS INSTRUMENTS n=u2s c Output Swmg (w N’ THD 00m 10 10!) 1x Fvequency {Hz} suwaw v§=sv Twme (15 GM
SHORTCIRCUIT CURRENT vs TEMPERATURE
Temperature (_C)
ISC (mA)
120
100
80
60
40
20
0
20
40
60
80
100 25 0 25 50 75 100 125
50
VS=±2.75V
VS=±2.75V
VS=±0.9V
VS=±2.5V
VS=±2.5V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
Output Current (mA)
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5
1.0
1.5
2.0
2.5
3.0 10 20 30 40 50 60 70 80 90
0
Output Swing (V)
VS=±0.9V
VS=±2.5V
TA= +25_C
TA= +125_C
TA=
+125_CTA=40_C
TA=40_C
0.1Hz TO 10Hz NOISE
Time (1s/div)
5µV/div
SMALLSIGNAL OVERSHOOT vs LOAD CAPACITANCE
Load Capacitance (pF)
60
50
40
30
20
10
01000 3000
100
Overshoot (%)
VS= 5V
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
TYPICAL CHARACTERISTICS (continued)
At T
A
= +25 ° C, R
L
= 10 k connected to V
S
/2, REF pin 1 connected to ground, and REF pin 2 connected to V
REF
= 5 V,unless otherwise noted.
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SMALL−SIGNAL STEP RESPONSE
Time (500ns/div)
200mV/div
LARGE−SIGNAL STEP RESPONSE
Time (500ns/div)
1V/div
SETTLING TIME
Time (250ns/div)
2mV/div
VOUT = 4V Step
CL= 100pF
INA159-EP
SBOS443 – NOVEMBER 2008 ..........................................................................................................................................................................................
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TYPICAL CHARACTERISTICS (continued)
At T
A
= +25 ° C, R
L
= 10 k connected to V
S
/2, REF pin 1 connected to ground, and REF pin 2 connected to V
REF
= 5 V,unless otherwise noted.
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APPLICATION INFORMATION
VCM)+(V)))5[(V))*(0.5VREF)]
(3)
VCM*+(V*)*5[(0.5VREF)*(V*)]
(4)
COMMON-MODE RANGE
VCM)+(V)))5[(V))*VREF]
(1)
VCM*+(V*)*5[VREF *(V*)]
(2)
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
The internal op amp of the INA159 has a rail-to-railcommon-mode voltage capability at its inputs. Arail-to-rail op amp allows the use of ± 10-V inputs into
Some typical values are shown in Table 1 .a circuit biased to 1/2 of a 5-V reference (2.5-Vquiescent output). The inputs to the op amp will swing
Table 1. Common-Mode Range For Variousfrom approximately 400 mV to 3.75 V in this
Supply and Reference Voltagesapplication.
REF 1 and REF 2 Connected TogetherThe unique input topology of the INA159 eliminates
V+ V V
REF
V
CM+
V
CM the input offset transition region typical of mostrail-to-rail complementary stage operational 5 0 3 15 15amplifiers. This allows the INA159 to provide superior
5 0 2.5 17.5 – 12.5glitch- and transition-free performance over the entire
5 0 1.25 23.75 – 6.25common-mode range.
1/2 Reference ConnectionGood layout practice includes the use of a 0.1- µF
V+ V V
REF
V
CM+
V
CM bypass capacitor placed closely across the supply
5 0 5 17.5 12.5pins.
5 0 4.096 19.76 – 10.24
5 0 2.5 23.75 – 6.25
3.3 0 3.3 11.55 – 8.25The common-mode range of the INA159 is a function
3.3 0 2.5 13.55 – 6.25of supply voltage and reference. Where both pins,
3.3 0 1.25 16.675 – 3.125REF1 and REF2, are connected together:
Where one REF pin is connected to the reference,and the other pin grounded (1/2 referenceconnection):
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l TEXAS INSTRUMENTS T v M v $ 4 f N. N. [M \1, ’VV A $
20k100k
40k100k
40k
OUT
VREF
5V
V+
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
20k
100k
40k
100k
40k
OUT
VREF
5V
V+
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
INA159-EP
SBOS443 – NOVEMBER 2008 ..........................................................................................................................................................................................
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Input and Output Relationships for Various Reference and Connection Combinations
V
REF
V
OUT
for V
IN
= 0 LINEAR V
IN
RANGE USEFUL V
OUT
SWINGREF CONNECTION(V) (V) (V) (V)
+10 4.55 2.5 0 ( ± 2V swing)– 10 0.5
10 4.0484.096 2.048 0 ( ± 2V swing)– 10 0.048
+10 3.653.3 1.65 0 ( – 1.577V, +2V swing)– 7.885 0.048
+10 (also +5) 3.252.5 1.25 0 ( – 1.2V, +2V swing)– 6 (also – 5) 0.048
+10 2.91.8 0.9 0 ( – 0.852V, +2V swing)– 4.26 0.048
+10 4.52.5 2.5 0 ( 2V swing)– 10 0.5
+10 3.81.8 1.8 0 ( – 1.752V, +2V swing)– 8.76 0.048
+10 3.21.2 1.2 0 ( – 1.15V, +2V swing)– 5.76 0.048
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20k
100k
40k
100k
40k
R1
100ADS8325
ADC
DOUT
DCLOCK
CS
REF
VREF5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
20k
100k
40k
100k
40k
R1
100ADS8361 or
ADS7861
ADC
DOUT
DCLOCK
CS
REF
VREF5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
Figure 3. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs
Figure 4. Typical Application Circuit Interfacing to Medium-Speed, Single-Supply ADCs withPseudo-Differential Inputs (such as the ADS7861 and ADS8361)
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l TEXAS INSTRUMENTS ‘2 :4 ; ¥ 11 i n P J:
20k
100k
40k
100k
40k
R1
100
REF
VREF5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
a) Unipolar, Noninverting, G = 0.2
20k
100k
40k
100k
40k
R1
100
REF
VREF5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
VIN +IN
IN
INA159
b) Bipolar, Noninverting, G = 0.2
20k
100k
40k
100k
40k
R1
100
ADC
ADC
ADC
REF
VREF5V
+IN
IN
V+
V+
GND
C1
1000pF
SENSE
REF 2
REF 1
+IN
IN
INA159
c) Unipolar, Unity Gain
VIN
INA159-EP
SBOS443 – NOVEMBER 2008 ..........................................................................................................................................................................................
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Figure 5. Basic INA159 Configurations
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20k
100k
40k
100k
40k
5V
V+
SENSE A
OUT A
REF 2A
REF 1A
VIN+
VIN
+IN A
IN A
INA159
20k
100k
40k
100k
40k
5V
ADC
REF
VREF
+IN
IN
V+
V+
GND
SENSE B
OUT B
REF 2B
REF 1B
+IN B
IN B
INA159
100
100
1000pF
1000pF
INA159-EP
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.......................................................................................................................................................................................... SBOS443 – NOVEMBER 2008
Figure 6. Differential ADC Drive
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
INA159AMDGKTEP ACTIVE VSSOP DGK 8 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -55 to 125 OAA
V62/09613-01XE ACTIVE VSSOP DGK 8 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -55 to 125 OAA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE OPTION ADDENDUM
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Addendum-Page 2
OTHER QUALIFIED VERSIONS OF INA159-EP :
Catalog: INA159
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«PT» Reel Diame|er AD Dimension des‘gned to accommodate the componem wwdlh E0 Dimension damned to eccemmodam the component \ength KO Dimenslun desgned to accommodate the componem thickness 7 w Overen with loe earner cape i p1 Pitch between successwe cavuy eemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
INA159AMDGKTEP VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
INA159AMDGKTEP VSSOP DGK 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA DGK (S—PDSO—GS) PLASTIC SMALL—OUTLINE PACKAGE m1 WW“: {[0 VAX % j 3,010 I 4073329/E 05/06 NO'ES' A AH imec' dimensmrs c'e m m'hmeiers 5 Th: drawing is enmec: :e change within: nciice. Body icnqth Coos mi mciucc maid Hash, protrusions or we tms Mom 'iush, aromons, ov qaw burrs shaH m exceed 015 per end b Budy mm does not wcude inierieud flasi‘ inieriead ‘iush s'mii 'mi exceed 050 pe' we : FuHs wiUHn JEDEC M0487 quulion AA, except 'vievieud ricer INSTRUMENTS w. (i. com
LAND PATTERN DATA DGK (37PD30708) PLASTIC SMALL OUTLINE PACKAGE Exampie Board Layout Exampie stencii Openings Based on a stencii thickness of .127mm L005inch), (See Nate 0) (,0 65) TYP ‘ Li 5 LLLLL L, pm ,,,,, PKG PKG "\ i i 4 — ----- i — ----- i D DU D i i ’ PKG PKG Q G . / Exampie , Non Soldermusk Defined Pad i , , —\ L A ~/ ‘\ Example \ Spider Musk Opening / +1 1‘(0,45) ‘ (See Note E) t 1 (1,45) < ‘="" \pud="" geometry="" ’="" (see="" note="" c)="" \="" +ii¢="" (0,05)="" \="" ah="" around="" «="" ,="" \="" e="" ’="" i="" ‘\-=""> muss/A 11/13 NOTES: A. Ali iinear dimensions are in miilimeters. a. This drawing is subject ta change without natiee, C, Publication |PCi7351 is recommended ior alternate designsu a. Laser cutting apertures with trapezoidui walls and aisa rounding corners w‘iH ofler eetter paste veiease. Customers snouid Contact their board ussembiy site for stencii design recommendations. Rater tn IFS—7525 for other slenci'i recummendutions. Customers should Contact their tmurd fabrication site for solder musk tolerances between and around signal pads. .r'I {I TEXAS INSTRUMENTS www.li.com
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