387001828 Datasheet by Tark Thermal Solutions

HiTemp ET Series ET15,28,F2,525 Thermoelectrlc Modules FEATURES APPLICATIONS TECHNICAL SPECIFICATIONS THICKNESS (PRIOR TO THINNING) SUFFIXI LATNESS & PARALLELISMI HOT FACE I COLD FACE I LEAD LENGTH SEALING OPTIONS SUFFIX I SEALANT I COLOR I TEMPERATURERANGE I DESCRIPTION ETS-DS-ETISIZBIF2I5252 0518
A
The HiTemp ET Series of Thermoelectric Modules (TEMs) are designed to operate in high temperature
environments.
This product line is available in multiple configurations and is ideal for applications that operate in
temperatures above 80°C. Assembled with Bismuth Telluride semiconductor material, thermally
conductive Aluminum Oxide ceramics and high temp solder construction, the ET Series is designed for
higher current and larger heat-pumping applications.
High-temperature operation
Reliable solid state
No sound or vibration
Environmentally-friendly
RoHS-compliant
Automotive cooling
Telecom cooling
Outdoor environments
Medical heating/cooling
Hot Side Temperature (°C)
85
110
Qmax (W)
338
347
Delta Tmax (°C)
87
94
Imax (Amps)
15
15
Vmax (Volts)
42.3
46.0
Module Resistance (Ohms)
2.74
3.03
TA
0.001”/0.001
Lapped
Lapped
6
TB
0.0005”/0.0005”
Lapped
Lapped
6”
RT
RTV
Clear
-60 to +204 °C
Non-corrosive, silicone adhesive
EP
Epoxy
Black
-55 to +150 °C
Low density syntactic foam epoxy encapsulant
ET15,28,F2,5252 Thermoelectric Modules Qc vs I Qh vs I 4000 7 1mm) 3m _areu»c PM —uT:|r: 3m 0 —dl’: JET 300.0 —dT= JO'C . 7mm 7 g 2m —are2a c 7 5m.“ —arezo-c 2mm —dr:3u': — 500.0 —uT:3a'( 150,0 —ar=m'c 5 :3: —aT:wc 1m" —dr:sa': 2ij —dT:50'c 5”” —dr=m'c 1mm —dT=60'C an 7 . m: D“ 5” “7D 15D “'7“ an 50 mo 15.0 _"’7‘" nun-mm —fl=m cumm m —dT=m V vs I COP vs I _ur : a: —a'r = v: —dT=10'C —GT=1U'C —dT:m'£ —m=2o~c —aT=ao'c —nT:3o'c —dT:MT[ —flT:MTC _dT=w-c _m:m —uT:m'( —m=s
PERFORMANCE CURVES AT Th = 85° C
MECHANICAL DRAWING
Maximum Operating
Temperature: 150°C
Do not exceed Imax or
Vmax when operating
module
Reference assembly
guidelines for
recommended installation