BA56-12YWA Datasheet by Kingbright

Kl'ngbrl'ghI 37.511 .48) Iz.5(o.492) 12.5(0.A92) ‘ mg” ‘2 mg] 7 D113 RECOMMENDED PCB LAYOUT E \ am 19(.74a) 15.24015) m .ss(n.n55) ¢0.5(.01)
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090
14.22mm (0.56INCH) THREE DIGIT NUMERIC
DISPLAY
Part Number: BA56-12YWA Yellow
Features
z0.56 inch digit height.
zLow current operation.
zExcellent character appearance.
zEasy mounting on P.C. boards or sockets.
zMechanically rugged.
zStandard: gray face, white segment.
zRoHS compliant.
Description
The Yellow source color devices are made with Gallium
Arsenide Phosphide on Gallium Phosphide Yellow Light
Emitting Diode.
Package Dimensions& Internal Circuit Diagram
Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
Kl'ngbrl'ghI
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090
Selection Guide
Note:
1. Luminous intensity/ luminous Flux: +/-15%.
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
Part No. Dice Lens Type
Iv (ucd) [1]
@ 10mA
Min. Typ.
BA56-12YWA Yellow (GaAsP/GaP) White Diffused 2200 6500 Common Anode ,Rt.
Hand Decimal.
Description
Symbol Parameter Device Typ. Max. Units Test Conditions
λpeak Peak Wavelength Yellow 590 nm IF=20mA
λD [1] Dominant Wavelength Yellow 588 nm IF=20mA
Δλ1/2 Spectral Line Half-width Yellow 35 nm IF=20mA
C Capacitance Yellow 20 pF VF=0V;f=1MHz
VF [2] Forward Voltage Yellow 2.1 2.5 V IF=20mA
IR Reverse Current Yellow 10 uA VR=5V
Parameter Yellow Units
Power dissipation 75 mW
DC Forward Current 30 mA
Peak Forward Current [1] 140 mA
Reverse Voltage 5 V
Operating / Storage Temperature -40°C To +85°C
Lead Solder Temperature[2] 260°C For 3-5 Seconds
Kl'ngbrlghl 5 YELLOW g 1‘0 TA=25'C 5 E .9 u 0.5 u m a. .2 a 7 o a m 450 500 550 600 550 700 750 wavelengih x (mm) RELATWE INTENSHY Vs. WAVELENGTH < a="" e="" 2.5="" .1="" o="" e="" 3="" 2.0="" e="" e6="" 1.5="" 3="" 2="" 2="" 5="" e="" 1.0="" e="" ..=""> E g 9 11.5 ‘2 5 a 1.5 1.71.9 2.1 2.3 2.5 4“ Do 4 5 ‘2 IE 20 Favwnrd vmmgam “Jamar: Currenl (m) ronARD CURRENI Vs. LumNGUS wtmsmr w. FORWARD VOLTAGE FORWARD CURRENY so > 2.5 2‘ a £4“ E 2,0 E3“ 7; ‘5 an gm Em : 0.5 E % a g o a 20 AD 50 so mu m a 72L} 0 20 AU so an Amb'mm hmpnmfiuva TA(‘C) Ambmnl T-mp'mmn n (‘6) ronwm: ammo" LuwNous IerNsnv v.. DERAHNG CURVE maxim YEMFERAWRE
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090
Yellow BA56-12YWA
Kl'ngbrl'ghI $fin§n§a§ a __ INS \ DE LABEL ‘SFCS/TUEE OUTS‘DE 90 TUBE/BOX H7OPCS/BOX l—nside Label on \C*Tube TYPE. Ex56— t2xxx (Ddfe K'"""""" 13 PCS CUBE '/ H: “mm _ Number or FOO xxx xxxx—x xxx RoHS Comphanl LOT ND Ouls'wde Labe‘ on Box HHHHHHHHHHW Bx56—12xxx Bin Code Number OF GA 1170 PCS XX /QA\/:— Dave xxx xx Xx/ SPEC NO: DSAC1278 REV NO: v.10 DATE: MAR APPROVED: WVNEC CHECKED: Joe Lee DRAWN: J.V
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 4 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090
PACKING & LABEL SPECIFICATIONS BA56-12YWA
Kt'ngbrt'ght THROUGH HOLE DISPLAY MOUNTING METHOD Lead Forming Do not bend the component leads by hand without proper tools. The leads should be bent by clinching the upper part of the lead firmly such that the bending force is not exerted on the plastic body. Cllnch the lad termthat wlth the bulging tuol r(benatng emu) F7 “(b-mil": WI") Net Reeemmehded Rncammundld Installation 1.The installation process should not apply stress to the lead terminals. 2.When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching the lead terminals. Not Recommended Raoummlndud DISPLAY SOLDERING CONDITIONS Wave Soldering Profile For Leadifree Throughihole LED. "Wfl 275? * zen-c IEIX/j 5531: i r 256 $30'C. 2257 I I I I I I , 206 I757 7 7 7 0 «I'm I I § 156 7 7 7 7 7 I I ‘g 125 (lure) I I E too7 7 7 7 7 r" 75 I I m 25 A A A 0 M 0 SD 100 150 200 250 300 350 M30 . (sec) Ttme NOTES: t.Reaemmeha the wave temperature 245-c~2so-c,The maximum soldering temperature should be less than ZEO'C. 2.Do not apply etrees an epaxy resins when temperature is over 85‘0. the soldering prante apply tn the lead free eataertng (Sn/Cu/Ag attey), 4,During wava eetdertng . the PCB top—awful:- tempereture should he kupt hetew 105'c 5.No more than once.
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 5 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090
Kl'ngbrl'ght Soldering General Notes: a. Through—hole displays are incompatible with reflow soldering. b. lf components will undergo multiple soldering processes. or other processes where the components may be subjected to intense heat. please check with Kingbright for compatibility. CLEANING 1.Mi|d "no—clean" fluxes are recommended for use in soldering. 2. If cleaning is required, Kingbright recommends to wash components with water only. Do not use harsh organic solvents for cleaning‘ because they may damage the plastic parts .And the devices should not be washed for more than one minute. CIRCUIT DESIGN NOTES 1.Frotective current—limiting resistors may be necessary to operate the Displays. 2.LEDs mounted in parallel should such be placed in series with its own current—limiting resistor. Invalld Set-up Recommended Seirup VS " " vs fl "7 GND
SPEC NO: DSAC1278 REV NO: V.10 DATE: MAR/23/2011 PAGE: 6 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: J.Yu ERP: 1303000090