Webinar – How to Defeat Heat in Your Design with DC Fans
When designing consumer electronics, industrial systems, or embedded devices, managing heat is critical. Forced air cooling can be critical in product success.
Axial Fans Propel the Shift from AC to EC Motors
Advanced EC motors and axial fans from ebm-papst drive energy-efficient innovations in ventilation and cooling solutions.
Thermoelectric Generators: What They Are and How They Work
Publish Date: 2025-09-03
Thermoelectric generator modules (often called TEGs) work by turning temperature differences into electrical voltage, or the other way around.
Ultra-Soft Thermal Pads for Heat Management Applications
Publish Date: 2025-07-16
Ultra-soft thermal pads improve server cooling efficiency by enhancing heat transfer, reducing thermal resistance, and protecting sensitive components.
The Hidden Trick to Size Heat Sinks for Modern Technology
Every electronic component in a device produces heat. To avoid “bricking” designs, engineers must ensure every component operates at a safe temperature.
Understanding Computational Fluid Dynamics in Electrical Engineering
Publish Date: 2025-01-03
Managing heat transfer and cooling systems is crucial for ensuring reliability and efficiency. CFD can now be used as a precise and realistic modeling approach.
Embedded Board Thermal Management Solutions
Publish Date: 2024-09-05
Thermal management techniques are crucial for maintaining devices in optimal operating condition. Electronics advancements have driven innovative technologies.
The Chemistry of Heatsinks
Explore the essential role of heat sinks in electronics, from their materials and design considerations to their impact on device performance and longevity.
Understanding Thermal Challenges in EV Charging Applications
Publish Date: 2024-03-13
As EVs emerge as the dominant mode of transportation, factors such as battery range and quicker charging rates will play pivotal roles in the global economy.
High-Performance Cooling: How Diagonal Compact Fans are Changing the Game
Publish Date: 2024-02-08
Compact axial fans with centrifugal fan characteristics are an innovation in thermal management.
A Novel Approach to Implementing Precise, Low-Power, and Compact Temperature Monitoring
Publish Date: 2023-10-18
How to use a purpose-built IC with positive temperature coefficient thermistors for precise, low-power, and compact temperature monitoring.
DigiKey Partners with GroupGets to Help Startups GetMade
DigiKey is partnering with GroupGets to help startups GetMade! This partnership will help startups who have fallen short of a successful crowdfunding campaign.
Common Methods to Protect Electronics Projects from Water and Dust
This article discusses various methods to water- and dust-proof electronics projects to protect them against taking damage from the environment.
Don’t Forget About Thermal Interface Materials
Publish Date: 2023-05-02
A Thermal Interface Material (TIM) is of utmost importance in providing optimal performance for fans, heatsinks, and Peltier devices.
Five Convenient Ways to Locate a Cross, Sub, or Replacement on DigiKey's Website
Finding an equivalent to an obsolete part can be difficult. However, DigiKey’s website has tools to help find crosses to parts quickly and easily.
Fan-Driven, Forced-Air Cooling: Push Air In Or Pull It Out?
Using fans for cooling electronics is a standard technique, but should they push air in or pull it out of the assembly they are cooling?
How to Rapidly Deploy Edge-Ready Machine Learning Applications
Publish Date: 2022-08-04
The implementation of machine learning at the edge has been greatly simplified by NXP’s i.MX RT1170 Crossover MCU and associated board and software tools.
How to Select and Apply Board-Mounted DC/DC Converters in Medical Systems
Publish Date: 2022-06-28
Use the right off-the-shelf DC/DC converter to accelerate medical system power supply design while meeting operator, patient, and system safety needs.
An outline of the basic operating principles of axial and centrifugal fans, their common applications and uses, and their advantages and disadvantages.
Use gap filler and heat spreader thermal interface materials to design optimal cooling solutions for electronic devices.

