GRM32NR61A226KE19 Ref Sheet Datasheet by Murata Electronics

ur Cap Change (RelTemp) (25 ”C) 5.Package EMBOSSED W8P4 EMBOSSED W8P4

GRM32NR61A226KE19_ (1210, X5R:EIA, 22uF, DC10V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

1.0 min.

(1)-1 L

3.2±0.3

(1)-2 W

2.5±0.2

e

Chip Monolithic Ceramic Capacitor for General

mark

(4)

Rated

Voltage

Packaging Unit

DC 10 V

Temp. Range

(Ref.Temp.)

(8) Packaging

Temp. coeff

or　Cap. Change

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

1.35±0.15

-55 to 85 °C

-15 to 15 %

-55 to 85 °C

(25 °C)

(6)

Capacitance

Tolerance

22 uF

Specifications and Test

Methods

(Operating

Temp. Range)

±10 %

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

g

0.3 min.

(5) Nominal

Capacitance

L

f180mm Reel

EMBOSSED W8P4

2000 pcs./Reel

K

f330mm Reel

EMBOSSED W8P4

8000 pcs./Reel

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging Code



Code

GRM 32 NR6 1A 226 K E19 L

GRM32NR61A226KE19-01 1

■ Specifications and Test Methods

No

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated voltage

range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities.

Measurement Point　　 :

Between the terminations

Test Voltage 　　　　　　 :

250% of the rated voltage

Applied Time :

1 to 5 s

Charge/discharge current :

50mA max.

5 Insulation Resistance(I.R.) 

Measurement Point 　　 : Between the terminations

Measurement Voltage :

DC Rated Voltage

Charging Time :

1 min

Charge/discharge current :

50mA max.

Measurement Temperature :

Room Temperature

6 Capacitance Shown in Rated value.

Measurement Temperature :

Room Temperature

7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.

D8,GRM31CR60J107 : 0.15 max

GRM31CR71E106 : 0.125

max

*1 For items listed in Table 1 on the left, the capacitance should

be measured using a voltage of 0.5+/-0.1Vrms instead of

1.0+/-0.2Vrms.

*2 For item GRM188R70J105, the capacitance should be measured

using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.

8

Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.

Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.

of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be

C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of

C7 : Within+/-22% (-55°C to +125°C) each temp. stage.

C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.

E7 : Within +22/-56% (-55°C to +125°C)

D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage

D8 : Within +22/-33% (-55°C to +105°C) GRM152 B3 0J 104/224, GRM155 B1 0J 124 to 334,

GRM155 B3 0J 394 to 824, GRM155 B3 1A 124 to 105,

GRM188B10G106, GRM21BB10J106 　only : 0.20+/-0.05Vrms

50% of B1: Within +10/-30% 　 GRM21B R7 1A/1C 475 K/M E51, GRM219 R7 1A/1C 225

the rated R1: Within +15/-40% only : 0.5+/-0.1Vrms

voltage GRM188R61H474 only : 1.5+/-0.3Vrms

･Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

c

b

a

Solder Resist

Chip Capacitor

Land

Capacitance

Frequency

Voltage

*1 C≦

(10V min.)

1.0+/-0.1kHz

1.0+/-0.2Vrms

*2 C≦

(6.3V max.)

1.0+/-0.1kHz

0.5+/-0.1Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

Step

Temperature(C)

Applying Voltage(VDC)

1

Reference Temp.+/-2

No bias

2

Min.Operating Temp. +/-3

3

Reference Temp. +/-2

4

Max.Operating Temp. +/-3

5

Reference Temp. +/-2

50% of

the rated voltage

(For B1,R1)

6

Min.Operating Temp. +/-3

7

Reference Temp. +/-2

8

Max.Operating Temp.+/-3

*Table 1

GRM033 B3/R6 1A 123 to 823

GRM033 B3/R6 1A 104

GRM155 B3/R6 1A 124 to 105

GRM185 B3/R6 1C/1A 105

GRM185 C8/D7 1A 105

GRM188 B3/R6 1C/1A 225

GRM188 R7/C8/D7 1A 225

GRM188 B3/R6 1A 335

GRM219 B3/R6 1C/1A 475

GRM219 C8 1A 475

GRM219 B3/R6 1A 106

GRM21B B3/R6 1C/1A 106

GRM21B R7/C8 1A 106

GRM319 B3/R6 1C/1A 106

JEMCGS-0052AM 2

No

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

D.F. Within the specified initial value.

Kind of Vibration :

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude :

1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-10% Pressurization method : Shown in Fig.2

Change Flexure　　　　: 1mm

Holding Time 　 :

5+/-1s

Soldering Method :

Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and

Test Method :

Solder bath method 

continuously. Flux Solution of rojin ethanol 25(wt)%

Preheat :

80℃ to 120℃ for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time

:

2+/-0.5s

13

Resistance Appearance No defects or abnormalities. <GRM03 size min.>

to Test Method : Solder bath method 

Soldering Solder : Sn-3.0Ag-0.5Cu

Heat Solder Temp. :

270+/-5℃

Immersion time

:

10+/-0.5s

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 　: Within +/-7.5% Exposure Time : 24+/-2h

Change GRM188B30J106M : Within +/-12.5% Preheat : GRM31 size max.: 120℃ to 150℃ for 1 min

　GRM32 size　　　 : 100℃ to 120℃ for 1 min

and 170℃ to 200℃ for 1 min

· Initial measurement

D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test Method : Reflow soldering (hot plate)

I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Voltage proof No defects. Exposure Time : 24+/-2h

Preheat :

120℃ to 150℃ for 1 min

· Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

14

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Perform the five cycles according to the four heat treatments

shown in the following table.

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%

Change E7 : Within +/-30%

D.F. Within the specified initial value.

I.R. Within the specified initial value. Exposure Time : 24+/-2h

· Initial measurement

Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· GRM188B30J106M Measurement after test:

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Test Temperature :

40+/-2℃

High

Test Humidity :

90%RH to 95%RH

Humidity Capacitance Within +/-12.5%

Test Time :

500+/-12h

(Steady) Change

Applied Voltage :

DC Rated Voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max.

Exposure Time :

24+/-2h

· Initial measurement

I.R.

∙ F Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

c

b

a

Solder Resist

Chip Capacitor

Land

Step

Temp.(C)

Time

(min)

1

Min.Operating Temp.+0/-3

30+/-3

2

Room Temp

2 to 3

3

Max.Operating Temp.+3/-0

30+/-3

4

Room Temp

2 to 3

JEMCGS-0052AM 3

H Ms 20 1 Drum/s lPressunze LP Capacmance mew A5 45 Copper Ion tmckness 0 035mm ens

No

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Test Temperature :

Max. Operating Temp. +/-3℃

Capacitance Within +/-12.5%

Test Time :

1000+/-12h

Change

Applied Voltage :

150% of the rated voltage

Charge/discharge current : 50mA max.

Exposure Time :

24+/-2h

D.F. 0.2 max.

· Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

I.R.  · Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・ Kind of Solder : Sn-3.0Ag-0.5Cu

・ Land Dimensions

　 Fig.3

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

c

b

a

Solder Resist

Chip Capacitor

Land

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

t

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

40

a

c

b

Land

f4.5

c

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

45

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

45

R5

20

50 min.

Type

Dimension (mm)

a

b

c

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

JEMCGS-0052AM 4

1.1 Minimum Quami s./reel (in:mm)

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

3

5

1.2 Dimensions of Tape

(1)GRM01/02 (W4P1 CODE:L) (in:mm)

1

*3 Nominal value

10000(W8P2)

50000(W8P2)

4000

GRM55

GRM43

F

E

S

M

GRM32

GRM31

GRM21

GRM15

5(LW Dimensions Tolerance:±0.2

and T Dimensions:0.5 +0/-0.1)

5(LWT Dimensions Tolerance:±0.1min.)

5(LWT Dimensions Tolerance:±0.05)

N

C

R/D/E

GRM01

GRM02

2

3/X

5 (LW Dimensions Tolerance:±0.1min.

and T Dimensions Tolerance:±0.05)

GRM03

2

GRM18

6

9

A/B

6/9

M/X

10000(W8P2)

4000

M

N/R/D

4000

50000(W4P1)

E

N/C/R/D

C

9

A/M

Package

GRM Type

15000(W8P2)

20000(W8P2)

10000(W8P2)

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

4000

30000(W8P1)

20000(W8P1)

40000(W4P1)

3000

2000

3000

300

50000(W8P2)

2000

1000

10000

500

1000

500

1000

500

3000

10000

40000(W8P2)

50000(W8P2)

10000

1500

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

8000

6000

4000

10000

6000

10000

L





Type

1500

5000

4000

5000

4000

2000

W

T

t

0.145

0.27

0.4 max.

0.2±0.02

0.23

0.43

0.125±0.013

0.4±0.05

0.25±0.013

Type

0.2±0.05

0.26

GRM02

GRM01

2

0.4±0.02

15000(W8P2)

50000(W8P2)

0.5 max.

0.46

Dimensions(Chip)

A *3

B *3

t

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

*1

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

t

*2

0.05 max.

φ0.8±0.04

0.15～0.25

JEMCGP-01796E 5

(2)GRM03/15(WBP2 CODE:D/E/J/F) - ﬁjﬂ—B—E-ﬁ-H— ' ﬁlll'B'B-H—B-B ........

　(2)GRM03/15(W8P2 CODE:D/E/J/F)

(in:mm)

L W

T

2 0.2 +0.02/-0.04

0.3±0.03 0.5 max.

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05

*3 Nominal value

　(3)GRM033/155(W8P1 CODE:W) (in:mm)

L W

T

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

0.5 max.

Dimensions(Chip)

A *3

B *3

t

1.0±0.2

0.5±0.2

0.65

0.78

1.15

1.29

0.74

0.8 max.

0.5±0.05

0.3±0.03

0.65

1.15

Type

Dimensions(Chip)

0.6±0.03

GRM03

3

0.6±0.09

0.3±0.03

0.3±0.09

Package

GRM Type

A *3

B *3

t

0.37

5

0.67

GRM03

3

GRM15

3

1.0±0.05

Type

0.44

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

t

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

*1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

t

*2

0.05 max.

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

t

1.0±0.05

JEMCGP-01796E 6

Mk II E Q50 H L=U==%

　(4)GRM18/21/31/32 (in:mm)

L W

T

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

5

0.5±0.05

6 0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2 3.7 max.

Dimensions

of Tape

Package

GRM Type

1.15 max.

2.0±0.1

2.0±0.2

1.25±0.1

0.85±0.1

1.7 max.

Plastic Tape

A

Type

Dimensions(Chip)

A

B

t

1.6±0.2

Plastic Tape

2.5 max.

3.0 max.

M

C

2.5 max.

3.2±0.3

1.6±0.15

1.6±0.2

2.5±0.2

GRM32

2.80±0.20

3.50±0.20

1.7 max.

GRM31

2.00±0.20

3.60±0.20

1.15 max.

0.85±0.1

1.6±0.15

Paper Tape

9

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

3.2±0.15

3.2±0.2

GRM21

6

1.55±0.15

2.30±0.15

9

Paper Tape

1.05±0.10

1.85±0.10

1.25±0.2

0.8±0.2

0.8 max.

0.5 +0/-0.1

GRM18

1.10±0.10

2.00±0.10

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

t

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

t

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796E 7

(5)GRM43/55 (in:mm)

L W

T

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

t

3.7 max.

4.5±0.4

3.2±0.3

5.7±0.4

5.0±0.4

GRM55

5.2

6.1

2.5 max.

3.7 max.

Package

GRM Type

GRM43

3.6

4.9

2.5 max.

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

*

2.0±0.1

4.0±0.1

Ｂ

t

*：2.0±0.1

0.3±0.1

JEMCGP-01796E 8

Package

GRM Type

図

1

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

W

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

W

w1

GRM01/02

8.0 max.

5±1.5

GRM03/15/18/21/31/32

16.5 max.

10±1.5

GRM43/55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796E 9

1.12 Peelmg 011 force : 0.1 N to 0.6N in the direciion as shown be1ow. ' GRM01/02/03:0.05N~U.5N / 18% : : number and quanmy,wil1 be put in outside of reel.

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in:mm)

1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)

40±0.3mm(GRM03 min.)

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.

* GRM01/02/03:0.05N～0.5N

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

Package

GRM Type

図

1

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

Tail vacant Section

Chip-mounting Unit

Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

図

1

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

165～180°

Top tape

JEMCGP-01796E 10

nmRata Please contact us pelore using our products for the applications listed below which require especially high reliability lor the prevention of delects which might directly cause damage to the third party's lile, body or property. Aircralt equipment Aerospace equipment Undersea equipment Power plant control equipment Medical equipment Transportation equipment(vehicles.trains,ships,etct) Trailic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Application of similar complexity and/or reliability requirements to the applications listed in the above. Storage and Operation condition Room Temperature ol +5 to +40 and a Relative Humidity of 20% to 70%. Rating 1.1emgerature Dependent Characteristics 75 750 25 a 25 an 75 run

Caution

■Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

　 for the prevention of defects which might directly cause damage to the third party's life, body or property.

　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

　　　⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment

　　　⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.

■Storage and Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:

Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance.

Therefore, please maintain the storage temperature and humidity. Use the product within six months,

as prolonged storage may cause oxidation of the terminations (outer electrodes).

(2) Please confirm solderability before using after six months.

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen

sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes. The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and

carefully confirm the various characteristics in actual use conditions and the actual system.

[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]



!

-20

-10

-15

-5

5

0

10

15

20

Temperature (C)

-75 -50 -25 025 50 75 100 125 150

Capacitance Change (%)

-20

-10

-15

-5

5

0

10

15

20

Temperature (C)

-75 -50 -25 025 50 75 100

Capacitance Change (%)

JEMCGC-2701X 11

2.Measuremem of Capacilance 3A2]! 11 Voltage Typlcal Voltage Applled lo lhe DC capacxlor DC Voltage DC Vollage+AC AC Vollage Pulse Vollage T T WW l l (E Maximum possible applled vollage) 41192 ol AEEIied Voltage and Self-healing Temgeralure such that when measunng at atmosphenc lemperature of 25 ‘C, lhe product's self-heating remalns below 20“C and lhe surface

2.Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC capacitor

DC Voltage DC Voltage+AC AC Voltage Pulse Voltage

(E：Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4.Type of Applied Voltage and Self-heating Temperature

1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the

continuous application of an AC voltage or pulse voltage.

When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current

or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits

of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is

used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

1-1. The load should be contained to the level

　 such that when measuring at atmospheric

　　temperature of 25°C, the product's self-heating

　　 remains below 20°C and the surface

temperature of the capacitor in the actual circuit

remains within the maximum operating

temperature.

Caution

!

1

10

100

0 1 2 3

Current (Ar.m.s.)

4 5 6

Temperature Rise (C)

[Example of Temperature Rise (Heat Generation) in Chip

Monolithic Ceramic Capacitors in Contrast to Ripple Current]

Sample: R(R1) characteristics 10 Rated voltage: DC10V

Ripple Current

100kHz

500kHz

1MHz

E

0

JEMCGC-2701X 12

5. DC Voltage and AC Voltage Charact capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a type capacitor is used in a circuit that requires a constant circuit), please carelully consider the characteristics in the actual operating conditions ol the system. 6.0agac nceAg 9 have an Aging characteristic in which the capacitance 7.Vibration and Shock ol another printed circuit board should not be allowed to hit the capacitor in order to avoid 20 20 40 an an um Example of Change Over Time (Aging characteristics) ]

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type

capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a

capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change

sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the

capacitance.

(1) Determine whether the capacitance change caused

by the applied voltage is within the allowed range .

(2) In the DC voltage characteristics, the rate of

capacitance change becomes larger as voltage

increases, even if the applied voltage is below

the rated voltage. When a high dielectric constant

type capacitor is used in a circuit that requires a

tight (narrow) capacitance tolerance (e.g., a time

constant circuit), please carefully consider the

voltage characteristics, and confirm the various

characteristics in the actual operating conditions

　 of the system.

2. The capacitance values of high dielectric

constant type capacitors changes depending

on the AC voltage applied.

Please consider the AC voltage characteristics

when selecting a capacitor to be used in a

AC circuit.

6. Capacitance Aging

[ Example of Change Over Time (Aging characteristics) ]

1. The high dielectric constant type capacitors

have an Aging characteristic in which the capacitance

value decreases with the passage of time.

When you use a high dielectric constant type

capacitors in a circuit that needs a tight (narrow)

capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the characteristics

of these capacitors, such as their aging, voltage,

and temperature characteristics. In addition,

check capacitors using your actual appliances

at the intended environment and operating conditions.

7.Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or

a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability

may be deteriorated.

3. When printed circuit boards are piled up or handled, the corner

　of another printed circuit board

should not be allowed to hit the capacitor in order to avoid

a crack or other damage to the capacitor.

Caution

-100

-80

-60

-40

-20

0

20

0 10 20 30

DC Voltage (V)

40 50

[Example of DC Voltage Characteristics]

Sample: X7R(R7) Characteristics 

Capacitance Change (%)

0 0.5 1

AC Voltage (Vr.m.s.)

1.5 2

[Example of AC Voltage Characteristics]

Sample: X7R(R7) Characteristics 

Capacitance Change (%)

30

20

10

0

-10

-20

-30

-40

-50

-60

Floor

Crack

Mounting printed circuit board

Crack

!

20

10

0

-10

-20

-30

-40

10

100

1000

10000

Time(h)

Capacitance Change(%)

C0G(5C)

X7R(R7)

X5R(R6)

JEMCGC-2701X 13

Soldering and Mounting 1.Mounling Pas n 1-1.Choose a mounting posuien that minimizes the stress imposed on the chip during flexing or bending oi the board. [Component Direction] Locate chip horizontal lo the ©D:l]->D:l] 2.lnlormalion before Mountin

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

　 [Component Direction]

Locate chip horizontal to the

direction in which stress acts.

(Bad Example) (Good Example)

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

A　>　D *1

(2) Add slits in the board separation part.

A　>　B

(3) Keep the mounting position of the component away from the board separation surface.

A　>　C

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

2.Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

Caution

Contents of Measures

Screw Hole Recommended

!

①

②

③

1C

1B

1A

Perforation

Slit

A

B

C

D

①

1A

JEMCGC-2701X 14

3.M nlenance of (he Mounlin ick and lace Machine [I ncorrect] ET¥DEELZE\ [Correcl] / E\ /'E

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any damage or cracking. Please take into account the following precautions

and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

　 [Incorrect]

　 [Correct]

2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent

the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,

causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

Caution

!

Board Guide

Board

Suction Nozzle

Deflection

Support Pin

JEMCGC-2701X 15

4- Rellow Solde ng Tempeyaiuiel'c) lhe peak solder lemperalure is below the melling point of Table 1 :1) Series E s g k g 3.; Recommended Condilions soldering time must be within the range shown above This makes lhe chip more susceplible to mechanical and lhermal stress on lhe board and may cause the chips lo crack.

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and



2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

tin is used. Please confirm the solderability of tin plated

termination chips before use.

3. When components are immersed in solvent after mounting,



between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time]

shown in the table 1.

Table 1

Series

GRM

In the case of repeated soldering, the accumulated

Recommended Conditions

soldering time must be within the range shown above.

Lead Free Solder: Sn-3.0Ag-0.5Cu

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a excessive solder fillet height.

This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.

4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose

from the PCB.

4-3. Please confirm that solder has been applied smoothly to the termination.

Make sure not to impose any abnormal mechanical shocks to the PCB.

Caution

Lead Free Solder

Peak Temperature

Air or N2

Atmosphere

≦130℃

Temperature Differential

Inverting the PCB

240 to 260℃

Chip　Dimension(L/W)　Code

01/02/03/15/18/21/31

32/43/55

≦190℃

!

Temperature(℃)

Peak Temperature

Soldering

Gradual

Cooling

Preheating

ΔT

60-120 seconds

30-60 seconds

Time

190℃

170℃

150℃

220℃

Soldering Temperature(℃)

Soldering Time(s)

280

270

260

250

240

230

220

0

30

60

120

90

JEMCGC-2701X 16

4-2.Flow Solde ng Table 2 Series Prenealing condillons are shown in table 2. II is required to lemperalure can resull in leaching ol lne lerminations, Recommended Conditlons 5. Opllmum Solder Amounl lor Flow Soldering Soldenng mperamreCC [Standard Condiliens for Flow Soldenng]

4-2.Flow Soldering

1. Do not apply flow soldering to chips not listed in Table 2.

　　　　　[Standard Conditions for Flow Soldering]

Table 2

Series

GRM

2. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both of the components and the PCB.

Preheating conditions are shown in table 2. It is required to

[Allowable Flow Soldering Temperature and Time]

keep the temperature differential between the solder and



3. Excessively long soldering time or high soldering

temperature can result in leaching of the terminations,

causing poor adhesion or a reduction in capacitance value

due to loss of contact between the inner electrodes and terminations.

4. When components are immersed in solvent after mounting,



between the component and solvent within the range

shown in the table 2. In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Recommended Conditions

Lead Free Solder: Sn-3.0Ag-0.5Cu

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the

thickness of the components. If the solder amount is

excessive, the risk of cracking is higher during

board bending or any other stressful condition.

Atmosphere

100 to 120℃

250 to 260℃

Air or N2

Caution

Lead Free Solder

Preheating Peak Temperature

Soldering Peak Temperature

Chip　Dimension(L/W)　Code

18/21/31

≦150℃

Temperature Differential

!

Soldering mperature(℃)

Soldering Time(s)

280

270

260

250

240

230

220

0

10

20

40

30

Temperature(℃)

Soldering

Peak

Temperature

Preheating

Peak

Temperature

30-90 seconds

Preheating

5 seconds max.

Time

Gradual

Cooling

Soldering

ΔT

Up to Chip Thickness

Adhesive

in section

JEMCGC-2701X 17

4-3.Correction oi Soldered Portion Table 3 (L/W) Code Soldering Iron Tip Temperature Diﬁerential(AT) Lead Free Solder: Sn-3.0Ag-0.SCu 2-1. ll the distance lrom the hot air outlet ol the spot heater to the component ls too close, cracks may occur due to Table 4 Distance 5mm or more Hot Air Application angle 45” "Figure 1 Hot Air Temperature Nozzle Outlet 400°C max. Less than 10 seconds Application Time (3216M / 1206 size or smaller) Less than 30 seconds (3225M / 1210 size or larger) Onthole Nozz E an Angle ol dunng board bending or any other stressful condition.

4-3.Correction of Soldered Portion

When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,

and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending

on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.

Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.

1. Correction with a Soldering Iron

1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.

Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.

1-2. After soldering, do not allow the component/PCB to cool down rapidly.

1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,

there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the

adhesive strength and other problems.

Table 3

Lead Free Solder: Sn-3.0Ag-0.5Cu



2. Correction with Spot Heater

Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component

and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,

a spot heater can also prevent concerns of the soldering iron making direct contact with the component.

2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to

thermal shock. To prevent this problem, follow the conditions shown in Table 4.

2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown

in Figure 1.

Table 4

Distance 5mm or more

Hot Air Application angle 45° *Figure 1

Hot Air Temperature Nozzle Outlet 400°C max.

Less than 10 seconds

Application Time (3216M / 1206 size or smaller)

Less than 30 seconds

(3225M / 1210 size or larger) (3216M , 3225M : Metric size code)

3. Optimum solder amount when re-working with a soldering iron

3-1. If the solder amount is excessive, the risk of cracking is higher

　　　 during board bending or any other stressful condition.

Too little solder amount results in a lack of adhesive strength

on the termination, which may result in chips breaking

loose from the PCB.

Please confirm that solder has been applied smoothly is in section

and rising to the end surface of the chip.

3-2. A soldering iron with a tip of ø3mm or smaller should be used.

It is also necessary to keep the soldering iron from touching

the components during the re-work.

3-3. Solder wire with ø0.5mm or smaller is required for soldering.

Series

GRM

03/15/18/21/31

Caution

32/43/55

Preheating

Temperature



Chip　Dimension

(L/W)　Code

Temperature of

Soldering Iron Tip

Atmosphere

350℃ max.

150℃ min.

≦190℃

Air

150℃ min.

280℃ max.

≦130℃

!

One-hole Nozzle

an Angle of 45

[Figure 1]

Solder Amount

JEMCGC-2701X 18

5.Washing 6.Eleclrical Tes! on Primed Circ i: Board 7.Prinled Circuit Board Cro in 2. Check me cropping melhod forthe prmled cxrcuit board m advance

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips

or broken solder joints. Take note not to vibrate PCBs.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a

capacitor after mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder

joints. Provide support pins on the back side of the PCB to prevent warping or flexing.

Install support pins as close to the test-probe as possible.

1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.

[Not Recommended] [Recommended]

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that

caused bending or twisting the board.

1-1. In cropping the board, the stress as shown may cause the capacitor to crack.

Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.

Avoid this type of stress to a capacitor.

[Bending] [Twisting]

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router

type separator, etc.) to prevent the mechanical stress that can occur to the board.

* When a board separation jig or disc separator is used, if the following precautions are not observed,

a large board deflection stress will occur and the capacitors may crack.

Use router type separator if at all possible.

Caution

High

Medium

Notes

Hand and nipper

separation apply a high

level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Board handling

· Layout of slits

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

Recommended

Low

Level of stress on board

×

△*

◯

Board Separation Method

Hand Separation

Nipper Separation

(1) Board Separation Jig

Board Separation Apparatus

2) Disc Separator

3) Router Type Separator

!

Peeling

Test-probe

Support Pin

Test-probe

①

1A

JEMCGC-2701X 19

(Measures) [Hand Separation] rn Pnnted 2mm; Dlrection oi ioad Load perm beard Ii ii is difficuii Io introduce a rouier Iype separator, impiement the following measures [Cross-section Diagram] :{2 1% [V-groove Design] LJ

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows.

Recommended example: Stress on the component mounting position can be minimized by holding the

portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.

Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress

being applied to the component mounting position, if the portion away from the jig is held and bent in the

direction opposite the side where the capacitors are mounted.

[Outline of jig] [Hand Separation]

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

　 (Measures)

(1) Consider introducing a router type separator.

　　If it is difficult to introduce a router type separator, implement the following measures.

(Refer to item 1. Mounting Position)

(2) Mount the components parallel to the board separation surface.

(3) When mounting components near the board separation point, add slits in the separation position

near the component.

(4) Keep the mounting position of the components away from the board separation point.

(2) Example of a Disc Separator

An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top

blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.

In the following case, board deflection stress will be applied and cause cracks in the capacitors.

(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,

left-right or front-rear directions

(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom

IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the

V groove with consideration about strength of material of the printed circuit board.

[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]

[Disc Separator]

Top Blade Top Blade Top Blade Top Blade

Bottom Blade Bottom Blade Bottom Blade Bottom Blade

[V-groove Design]

Not recommended

Recommended

Top-bottom Misalignment

Left-right Misalignment

Front-rear Misalignment

Caution

Recommended

Not recommended

Depth too Shallow

Depth too Deep

Example of

Recommended

V-groove Design

Not Recommended

Left-right Misalignment

Low-Angle

Printed Circuit Board

Top Blade

V-groove

Bottom Blade

Top Blade Printed Circuit Board

V-groove

!

Board Cropping Jig

V-groove

Printed Circuit Board

Printed circuit

board

Components

Load point

Direction of

load

Printed circuit

board

Component

s

Load point

Direction of load

JEMCGC-2701X 20

The router type separamr peﬂorms cutting by a router 8. Assembly capacimrs have been moumed on (he opposne side. Q3) Plan the work so mat the board does not bend when a ‘ l *5}— En ﬂ} «,1

(3) Example of Router Type Separator

The router type separator performs cutting by a router

rotating at a high speed. Since the board does not

bend in the cutting process, stress on the board can

be suppressed during board separation.

When attaching or removing boards to/from the router type

separator, carefully handle the boards to prevent bending.

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend.

Firmly hold the edges of the board with both hands when handling.

If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other components on the back side of the board after

capacitors have been mounted on the opposite side.

When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied

to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.

· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.

· Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the

capacitors or cracks in the solder. Pay attention to the following.

· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.

· Fix the board with support pins or a dedicated jig before insertion.

· Support below the board so that the board does not bend. When using multiple support pins on the board,

periodically confirm that there is no difference in the height of each support pin.

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when a socket is attached or removed.

Plan the work so that the board does not bend when a socket is attached or removed.

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or

chassis. Pay attention to the following items before performing the work.

· Plan the work to prevent the board from bending.

· Use a torque screwdriver, to prevent over-tightening of the screws.

· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied

to the chips by forcibly flattening the board when tightening the screws.

Caution

!

Suction Nozzle

Component with Leads

Socket

Screwdriver

[ Outline Drawing ] Router

JEMCGC-2701X 21

Others 1. Under Ogemion of Eguigmenl 2. Others

■ Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions.

Do not use the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused

by the capacitor's high temperature.

2-2. Disposal of waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the

insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,

smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,

to prevent secondary accidents.

(2) This series are not safety standard certified products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used in special

mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

Caution

!

JEMCGC-2701X 22

Rating 1.09am ng Temgeralure 2.Atmosghere Surround gs gaseous and liguidl electrodes may result in breakdown when the capacitor is exposed lo corrosive or volatile gases or solvents 3.Piezo-eleclric Phenomenon

■ Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the maximum operating temperature.

It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.

It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable

factor.

1-2. Consider the self-heating factor of the capacitor

The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.

2.Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

　　electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

Notice

JEMCGC-2701X 23

Soldering and Mounting 1.PCB Design Pattern Forms 9“ .% ,% in section in section in section in section \% in section in section E“

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking.

When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility

of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress  

on a chip is different depending on PCB material and structure.When the thermal expansion coefficient

greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to

the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit

board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.

Pattern Forms

in section in section

Notice

Placing of Leaded

Components

after Chip Component

Lateral Mounting

Prohibited

Correct

Placing Close to Chassis

Placing of Chip

Components

and Leaded

Components

Chassis

Solder (ground)

Electrode Pattern

Solder Resist

Lead Wire

Solder Resist

Lead Wire

Soldering Iron

Solder Resist

ｿﾙﾀﾞﾚｼﾞｽﾄ

Solder Resist

JEMCGC-2701X 24

Tab‘e 1 How So‘dering Method (UW) Code How so‘dering can 0n‘y be used for pruducls wilh a chxp size 0f1.6x0.8mmlo 3.2x1.6mm. Tab‘e 2 Reﬂow So‘dering Method T0‘erance) 1.0x0.5 (withm :0.10) 1.0x0.5 :0.15/:0.20 1.5x0.8 (mm :0.10) 1.5x0.8 (:0.15/:0.20) 2.0x1.25 (wwlhm 10.10) 2.0x1.25 (:015) 2.0x1.25 (:020) 3.2m .6 (withm:0.20) 3.2m .6 (:030)

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress

of PCB bending , etc. if the land area is larger than

needed and has an excess amount of solder.

Please refer to the land dimensions in table 1

for flow soldering, table 2 for reflow soldering.

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.

(in mm)

Table 2 Reflow Soldering Method

1.0×0.5

(within ±0.10)

1.0×0.5

（±0.15/±0.20）

1.6×0.8

(within ±0.10)

1.6×0.8

(±0.15/±0.20)

2.0×1.25

(within ±0.10)

2.0×1.25

(±0.15)

2.0×1.25

(±0.20)

3.2×1.6

(within±0.20)

3.2×1.6

(±0.30)

(in mm)

GRM

01

0.25×0.125

0.10 to 0.11

0.07 to 0.12

0.4 to 0.6

GRM

31

3.2×1.6

2.2 to 2.6

GRM

02

0.4×0.2

0.16 to 0.2

Notice

Chip　Dimension

(L/W)　Code

Chip(L×W)

a

b

0.6 to 1.0

GRM

0.8 to 0.9

18

1.6×0.8

b

21

2.0×1.25

GRM

Chip(L×W)

(Dimensions

Tolerance)

Chip　Dimension

(L/W)　Code

1.0 to 1.2

0.9 to 1.0

1.0 to 1.1

a

0.12 to 0.18

GRM

03

0.6×0.3

1.2

0.6

GRM

1.0 to 1.4

0.2 to 0.3

0.2 to 0.35

1.0 to 1.3

1.2

0.6 to 0.8

0.35 to 0.45

0.4 to 0.5

0.6 to 0.8

0.6 to 0.7

0.7 to 0.9

0.7 to 0.8

0.3 to 0.5

GRM

32

3.2×2.5

2.0 to 2.4

1.0 to 1.2

43

3.0 to 3.5

1.2 to 1.4

55

5.7×5.0

4.5×3.2

4.0 to 4.6

1.4 to 1.6

GRM

0.6 to 0.8

1.8 to 2.0

0.9 to 1.2

1.9 to 2.1

Series

c

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

0.4 to 0.6

0.6 to 0.8

0.8 to 1.0

1.25

1.2 to 1.4

Series

c

0.125 to 0.145

0.2 to 0.23

0.2 to 0.4

1.5 to 1.7

1.7 to 1.9

1.8 to 2.3

2.3 to 3.0

3.5 to 4.8

15

18

21

31

0.5 to 0.7

c

b

a

Solder Resist

Chip Capacitor

Land

JEMCGC-2701X 25

y 2.Adhesive Agglicalion 5000Pa ~ 5 (500ps) min, (a‘ 25 ) Covera e Swze (LxW) (in mm) Adheswe Coverage" 1 6 x O 8 0.05mg min. 0.1m min. 0.15mg min. 3.Adhesive Curing 4.Flux “or Flow soldering} 1. An excessive amount of flux generates a large quantity m ﬂux gas, wmch can cause a deterioration of so‘derability.

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

2.Adhesive Application

1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.

The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding

strength. The chip's electrode thickness and land thickness must also be taken into consideration.

2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of

℃)

3. Adhesive Coverage

Size (L×W) (in mm) Adhesive Coverage*

1.6 × 0.8 0.05mg min.

2.0 × 1.25 0.1mg min.

3.2 × 1.6 0.15mg min.

*Nominal Value

3.Adhesive Curing

1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes

deterioration in the insulation resistance between the terminations due to moisture absorption.

Control curing temperature and time in order to prevent insufficient hardening.

4.Flux (for Flow soldering)

1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,

so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)

2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is

sufficient cleaning. Use flux with a halide content of 0.1% max.

3. Do not use strong acidic flux.

4. Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)

Notice

Land

Adhesive

Board

Chip Capacitor

a

b

c

a=20 to 

b=30 to 

c=50 to 105m

Relationship with amount of strain to the board thickness, length, width, etc.]



3PL

2Ewh2

Relationship between load and strain

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

uce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.



· As the board width (w) decreases, the amount of strain increases.



· As the board thickness (h) decreases, the amount of strain increases.



Since the board thickness is squared, the effect on the amount of strain becomes even greater.

：Strain on center of board (st)

L：Distance between supporting points (mm)

w ：Board width (mm)

h ：Board thickness (mm)

E ：Elastic modulus of board (N/m2=Pa)

Y ：Deflection (mm)

P ：Load (N)

Y

P

h

w

L

JEMCGC-2701X 26

5.Flow Solde ng Set temperature and time to ensure that ieaching at the mounted on substrate. 6.Rellow solder g by this kind of solder paste 7.Wash g B.Coating 3 The naiogen system substance and organic acid are inciuded in coating material, and a Chip corrodes by the kind of Coating material. Do not use strong acid type.

5.Flow Soldering

Set temperature and time to ensure that leaching of the

terminations does not exceed 25% of the chip end

area as a single chip (full length of the edge A-B-C-D

shown at right) and 25% of the length A-B shown as

mounted on substrate.

6.Reflow soldering

The halogen system substance and organic acid are included in solder paste, and a chip corrodes

　 by this kind of solder paste.

Do not use strong acid flux.

Do not use water-soluble flux.*

(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)

7.Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,

and select the solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance

of the capacitors.

8.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.

The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor

may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration

of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance

of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

3．The halogen system substance and organic acid are included in coating material, and a chip corrodes

　　by the kind of Coating material. Do not use strong acid type.

Notice

A

B

D

C

Termination

［As a Single Chip］

［As Mounted on Substrate］

A

B

JEMCGC-2701X 27

Others 1.1ransgorla on low air temperature : -40 change at temperature air/air : -25 /+25 low air pressure :30 kPa change at air pressure :6 kPa/mint capacitors, the capacitance may change depending on the operating conditions in the actual system. which wiii aiiect the capacitance value of the capacitcrt

■ Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.

(1) Climatic condition

　･ low air temperature : -40℃

･ change of temperature air/air : -25℃/+25℃

･ low air pressure : 30 kPa

･ change of air pressure : 6 kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

A capacitor dropped accidentally during processing may be damaged.

2.Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system.

Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,

which will affect the capacitance value of the capacitor.

3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in

the actual system. Evaluate the surge resistance in the actual system as required.

Notice

JEMCGC-2701X 28

NOTE

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

!

JEMCGC-2701X 29

GRM32NR61A226KE19 Ref Sheet Datasheet by Murata Electronics

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