Quick Dive Information on the Latest Product Additions and New Components.
Mechatronics fan trays deliver high airflow and low power consumption rack mountable thermal management solutions.
Taica’s COH-3114LVC thermal interface sheet material (TIM) is available in a variety of thicknesses and can be custom-cut to fit any design or application.
Orion’s LFG heavy-duty filter fan kit series prevents dust, dirt and moisture from entering enclosures available in a variety of options and fan sizes.
CUI's HSS series of heat sinks features high thermal conductivity to improve heat dissipation and are available with and without solder pins.
Orion Fans are designed for use in equipment where permanent, cleanable filters are most appropriate, such as networking, telecom and communications enclosures.
Explore Panasonic technologies like active and passive components, energy solutions, industrial automation and more.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
3M™ series 8926 thermally conductive interface tapes are filled with conductive ceramic particles for good converting availability, handling, and reworkability.
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.
Parker Chomerics' THERM-A-GAP™ 976 features fiberglass reinforced for improved tear strength and improved rework capabilities.
Parker Chomerics' T670 thermal grease with 3.0 W/m-K thermal conductivity is ideal for applications requiring thin bond lines.
Parker Chomerics' THERM-A-FORM is a dispensable form-in-place compound designed for heat transfer without compressive force in electronics cooling applications.
Parker Chomerics' THERMATTACH T418 offers excellent reliability when exposed to thermal, mechanical, and environmental conditioning.
Parker Chomerics' THERMFLOW T725 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMATTACH® T412 provides superior thermal conductivity and exceptional bonding properties between electronic components and heatsinks.
Parker Chomerics' THERMFLOW T558 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMATTACH® T411 provides bonding between electronic components and heat sinks, notably on plastic packages and low surface energy materials.
Delta Superflo bearing fans are the culmination of innumerable hours of research and development that result in newly augmented mechanical structures.
Laird's SuperCool TEAs offer precise temperature control of small chambers and are available in air-to-air, direct-to-air, and liquid-to-air versions.
Sanyo Denki's San Ace C270 9B1TP and San Ace C270 9B1TS bracket-mounted centrifugal fans are available in two sizes with an air inlet integrated into the unit.
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